Xilinx XC3S1400AN-4FGG676C

Part points

• The XC3S1400AN-4FGG676C chip is a field-programmable gate array (FPGA) from the Xilinx Spartan-3A FPGA family. It features 1,400 logic cells, operates at a maximum frequency of 250 MHz, and has 2,160 slices. It has 4 input/output banks and comes in the 676-pin FGGA package. This chip provides a versatile platform for implementing custom digital logic designs in various applications.

• Features

  The XC3S1400AN-4FGG676C is a field-programmable gate array (FPGA) with a capacity of 1400K logic cells and 432 Kb of RAM. It operates at a maximum speed of 675 MHz. It has 200 input/output pins and supports advanced communication protocols like Ethernet, USB, and PCI Express. It uses a 1.2V core voltage and offers a variety of power saving options.

• Pinout

  The XC3S1400AN-4FGG676C is an FPGA (Field-Programmable Gate Array) with a pin count of 676. It is a member of the Xilinx Spartan-3AN family and operates at a speed grade of -4. The specific pin functions can be found in the datasheet provided by Xilinx.

• Manufacturer

  The manufacturer of the XC3S1400AN-4FGG676C is Xilinx Inc. It is a semiconductor company that specializes in the design and development of programmable logic devices and associated technologies.

• Application Field

  The XC3S1400AN-4FGG676C is a field-programmable gate array (FPGA) with 1.4 million system gates. It is commonly used in applications such as automotive, industrial automation, communication systems, and medical devices. Its high performance and flexibility make it suitable for a wide range of applications that require programmable logic capabilities.

• Package

  The XC3S1400AN-4FGG676C chip has a FBGA package type, 676-ball grid array form, and a size of 27mm x 27mm.