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Xilinx XC3S1200E-4FTG256C
Spartan®-3E Field Programmable Gate Array (FPGA) IC 190 516096 19512 256-LBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S1200E-4FTG256C
Datasheet: XC3S1200E-4FTG256C Datasheet (PDF)
Package/Case: BGA-256
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3058 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC3S1200E-4FTG256C General Description
Spartan®-3E Field Programmable Gate Array (FPGA) IC 190 516096 19512 256-LBGA
Features
- It belongs to the Spartan-3E family of Xilinx FPGAs
- It has 1,228 user I/O pins and 1,200K system gates
- It operates with a 1.2V core voltage and can run at a clock speed of up to 500 MHz
- It has on-chip digital Clock Managers (DCMs) and Phase Locked Loops (PLLs) for clock management
- It supports various I/O standards such as LVCMOS, LVTTL, HSTL, SSTL, LVDS, and LVPECL
Application
- Digital signal processing
- Industrial automation and control
- High-performance computing
- Aerospace and defense systems
- Video and image processing
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
| RoHS: | Details | Series: | XC3S1200E |
| Number of Logic Elements: | 19512 LE | Adaptive Logic Modules - ALMs: | 8672 ALM |
| Embedded Memory: | 504 kbit | Number of I/Os: | 190 I/O |
| Supply Voltage - Min: | 1.14 V | Supply Voltage - Max: | 1.26 V |
| Minimum Operating Temperature: | 0 C | Maximum Operating Temperature: | + 85 C |
| Data Rate: | - | Number of Transceivers: | - |
| Mounting Style: | SMD/SMT | Package / Case: | FBGA-256 |
| Brand: | Xilinx | Distributed RAM: | 136 kbit |
| Embedded Block RAM - EBR: | 504 kbit | Maximum Operating Frequency: | 300 MHz |
| Moisture Sensitive: | Yes | Number of Gates: | 1200000 |
| Operating Supply Voltage: | 1.2 V | Product Type: | FPGA - Field Programmable Gate Array |
| Factory Pack Quantity: | 1 | Subcategory: | Programmable Logic ICs |
| Tradename: | Spartan |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S1200E-4FTG256C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S1200E-4FGG400C
Brands :
Package : FBGA-400
Description : FPGA Spartan®-3E Family 1.2M Gates 19512 Cells 572MHz 90nm (CMOS) Technology 1.2V
Part Number : XC3S1200E-4FG320C
Brands :
Package : BGA-320
Description : Spartan-3E FPGA 250 I/O 320FBGA
Part points
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The XC3S1200E-4FTG256C chip is a Field Programmable Gate Array (FPGA) device belonging to the Xilinx Spartan-3E family. It offers a range of digital logic and embedded IP cores, making it suitable for various applications like high-performance communications, automotive, and consumer electronics. With 1.2 million system gates and 768 I/O pins, this chip allows for flexible design customization and efficient implementation of complex digital systems.
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Equivalent
XC3S1200E-4FTG256C is an FPGA chip from Xilinx. Some equivalent products include XC3S1200E-4FGG320C, XC3S1200E-4FG400C, and XC3S1200E-4FGG456C. These chips offer similar functionality and features, but may have different package options. -
Features
The XC3S1200E-4FTG256C is an FPGA (Field-Programmable Gate Array) with 1.2 million system gates, 23808 logic cells, and 640 user I/O pins. It operates at a maximum frequency of 400 MHz, has 1200 Kbits of block RAM, and supports 49,920 flip-flops. It is manufactured by Xilinx and is widely used for digital logic design and prototyping. -
Pinout
The XC3S1200E-4FTG256C is a Field-Programmable Gate Array (FPGA) with a pin count of 256. The specific pin functions can be found in the device datasheet provided by the manufacturer. -
Manufacturer
The manufacturer of the XC3S1200E-4FTG256C is Xilinx. Xilinx is a technology company specializing in the development, production, and sales of field-programmable gate arrays (FPGAs) and related technologies. -
Application Field
The XC3S1200E-4FTG256C is a field-programmable gate array (FPGA) which can be used in various application areas, including industrial automation, telecommunications, automotive, and consumer electronics. Its high-density logic and abundant I/O make it suitable for complex system designs, signal processing, and control applications. -
Package
The XC3S1200E-4FTG256C chip comes in a 256-pin Fine Pitch Ball Grid Array (FBGA) package. Its form factor is a flat, square shape with pins arranged in a grid pattern underneath the chip. The size of the package is approximately 17mm x 17mm.
Datasheet PDF
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