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Xilinx XC3S1000-4FGG456I

Spartan®-3 Field Programmable Gate Array (FPGA) IC 333 442368 17280 456-BBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S1000-4FGG456I

Datasheet: XC3S1000-4FGG456I Datasheet (PDF)

Package/Case: BGA456

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2975 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC3S1000-4FGG456I General Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 333 442368 17280 456-BBGA

xc3s1000-4fgg456i

Features

  • Number of Logic Cells: 1,016
  • Maximum Operating Frequency: 350 MHz
  • Number of I/Os: 456
  • Number of DSP Slices: 8
  • Memory: 36 Kb
  • Package Type: FG456

Application

  • Aerospace and Defense: avionics, radar, and signal processing systems
  • Automotive: advanced driver assistance systems (ADAS), infotainment, and control systems
  • Industrial: automation, robotics, and control systems
  • Communications: wireless base stations, routers, and switches
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Specifications

Parameter Value Parameter Value
Case/Package FBGA Mount Surface Mount
Number of Pins 456 Max Operating Temperature 100 °C
Min Operating Temperature -40 °C Number of Gates 1e+06
Number of I/Os 333 Number of Logic Blocks (LABs) 1920
Number of Logic Elements/Cells 17280 Operating Supply Voltage 1.2 V
RAM Size 54 kB

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC3S1000-4FGG456I chip is a Field-Programmable Gate Array (FPGA) developed by Xilinx. It offers 1,000 logic cells and utilizes a 0.15µm copper process for efficient power consumption. The device features 10-bit, 14-bit, and 16-bit input/output (I/O) standards, and its FPGA fabric supports various features such as built-in memory blocks, digital signal processing (DSP) capabilities, and embedded Block RAM.
  • Equivalent

    Some equivalent products to the XC3S1000-4FGG456I chip are Xilinx Spartan-3A, Xilinx Spartan-6, and Intel (Altera) Cyclone III. These chips are similar in terms of their FPGA architecture and capabilities, making them viable alternatives to the XC3S1000-4FGG456I.
  • Features

    The XC3S1000-4FGG456I is a field-programmable gate array (FPGA) with 1,000,000 system gates. It operates at a maximum frequency of 400 MHz and has 456 ball grid array (BGA) package type. It has a 4 speed grade, and its I/O voltage is 1.8V.
  • Pinout

    The XC3S1000-4FGG456I is a Field-Programmable Gate Array (FPGA) with a pin count of 456. It has various functions including digital signal processing, networking, and general-purpose computation. The "4FGG" in the part number represents the device speed grade, and "456I" refers to the package type.
  • Manufacturer

    The manufacturer of the XC3S1000-4FGG456I is Xilinx. Xilinx is a semiconductor company specializing in advanced programmable logic devices.
  • Application Field

    The XC3S1000-4FGG456I is a field-programmable gate array (FPGA) that can be used in various applications such as telecommunications, video processing, industrial control systems, and medical imaging. It offers high performance, programmability, and flexibility, making it suitable for a wide range of digital circuit designs and signal processing tasks.
  • Package

    The XC3S1000-4FGG456I chip belongs to the Xilinx Spartan-3 Series. It comes in a compact 456-ball Fine-Pitch Ball Grid Array (FBGA) package with a size of 23mm x 23mm.

Datasheet PDF

Preliminary Specification XC3S1000-4FGG456I PDF Download

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