Xilinx XC2S50E-6FTG256I

Part points

• The XC2S50E-6FTG256I is a programmable logic device (PLD) manufactured by Xilinx. It belongs to the Spartan-II family of FPGAs and has 50,000 equivalent logic gates. The device offers 256 pins in a fine-pitch BGA (Ball Grid Array) package. It can be customized and reprogrammed to perform different functions and tasks, making it suitable for various applications in industries such as telecommunications, automotive, and consumer electronics.

• Equivalent

  XC2S50E-6FTG256I is a 50,000 logic cell Xilinx Spartan-2E FPGA. Equivalent chips are XC2S30-6FTG256I (30,000 logic cells) and XC2S100E-6FTG256I (100,000 logic cells) in the same FPGA family.

• Features

  The XC2S50E-6FTG256I is a Field Programmable Gate Array (FPGA) by Xilinx. It has a capacity of 50,000 logic cells, operates at a maximum frequency of 6 MHz, and comes in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package.

• Pinout

  The XC2S50E-6FTG256I is a Field-Programmable Gate Array (FPGA) with a pin count of 256. It serves as a programmable logic device for various applications, offering flexibility and customization in electronic designs.

• Manufacturer

  Xilinx is the manufacturer of the XC2S50E-6FTG256I. It is a technology company specializing in the development and production of field-programmable gate arrays (FPGAs) and other programmable logic devices.

• Application Field

  The XC2S50E-6FTG256I is an FPGA device that can be used in a wide range of applications such as telecommunications, automotive, industrial control systems, and consumer electronics. Its high-performance capabilities and flexible programmability make it suitable for applications requiring real-time processing, high-speed data transfer, and complex logic implementations.

• Package

  The XC2S50E-6FTG256I chip has a Ball Grid Array (BGA) package type, a 256-ball grid array form, and a package size of 14mm x 14mm.