Xilinx XC2S300E-6FTG256I
FPGA - Field Programmable Gate Array
Brands: AMD Xilinx, Inc
Mfr.Part #: XC2S300E-6FTG256I
Datasheet: XC2S300E-6FTG256I Datasheet (PDF)
Package/Case: BGA-256
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3212 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC2S300E-6FTG256I General Description
XC2S300E-6FTG256I is a type of field-programmable gate array (FPGA) manufactured by Xilinx, which is a company that specializes in designing and producing programmable logic devices.
Features
- It has a maximum gate count of 300,000.
- It has 4.4 Mb of block RAM and 72 DSP slices.
- It has 381 user I/Os and supports LVDS signaling.
- It operates at a maximum clock frequency of 200 MHz.
- It has a 1.2V core voltage and 2.5V or 3.3V I/O voltage.
Application
- Communications: It can be used for high-speed serial communication protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet.
- Video and Image Processing: It can be used to implement complex image and video processing algorithms such as image filtering, compression, and edge detection.
- Control Systems: It can be used for motor control, power management, and other control applications.
- Industrial: It can be used for automation and control applications in industrial settings.
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
Product: | Spartan-IIE | Number of Logic Elements: | 6912 |
Number of I/Os: | 182 I/O | Operating Supply Voltage: | 1.8 V |
Minimum Operating Temperature: | - 40 C | Maximum Operating Temperature: | + 100 C |
Mounting Style: | SMD/SMT | Package / Case: | FBGA-256 |
Series: | XC2S300E | Brand: | Xilinx |
Distributed RAM: | 98304 | Embedded Block RAM - EBR: | 64 kbit |
Maximum Operating Frequency: | 275 MHz | Product Type: | FPGA - Field Programmable Gate Array |
Subcategory: | Programmable Logic ICs | Tradename: | Spartan |
Tags | XC2S300E-6FT, XC2S300E-6F, XC2S300E-6, XC2S300E, XC2S300, XC2S30, XC2S3, XC2S, XC2 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC2S300E-6FTG256I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC2S300E-6PQG208C
Brands :
Package : 208-BFQFP
Description : 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN
Part Number : XC2S300E-6FTG256C
Brands :
Package : BGA-256
Description : 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN
Part Number : XC2S300E-6PQG208I
Brands :
Package : QFP208
Description : 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN
Part Number : XC2S300E-6FGG456I
Brands :
Package : BGA-456
Description : 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN
Part points
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The XC2S300E-6FTG256I chip is an FPGA (Field-Programmable Gate Array) manufactured by Xilinx. It features 300,000 logic gates and 2832 slices, making it suitable for a range of applications that require high-performance programmable logic. The chip operates at a maximum speed of 235 MHz and comes in a 256-pin fine-pitch ball grid array (FBGA) package.
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Equivalent
Some equivalent products of the XC2S300E-6FTG256I chip are the XC2S150E-6FTG256I, XC2S200E-6FTG256I, XC2S400E-6FTG256I, and XC2S600E-6FTG256I. -
Features
XC2S300E-6FTG256I is an FPGA Xilinx Spartan-II device with 300,000 system gates, 64 I/O pins and 256 FTG256 package. It operates at a maximum speed of 200 MHz and includes features like 18 KB RAM, two DLLs, 4 DSP units, and JTAG programming interface for configuration. -
Pinout
The XC2S300E-6FTG256I is an FPGA (Field-Programmable Gate Array) with a pin count of 256. It features 300K system gates, operates with a 6-speed grade, and is manufactured by Xilinx. It is designed for a diverse range of applications, including telecommunications, automotive, and consumer electronics. -
Manufacturer
The manufacturer of the XC2S300E-6FTG256I is Xilinx Inc. It is a leading American technology company in the semiconductor industry specializing in programmable logic devices and related software development tools. -
Application Field
The XC2S300E-6FTG256I is an FPGA (Field-Programmable Gate Array) primarily used in various industrial and automotive applications. It is suitable for implementing complex digital designs, data processing, and control systems. This FPGA can be utilized in sectors such as telecommunications, robotics, automation, automotive electronics, and more. -
Package
The XC2S300E-6FTG256I chip is available in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package type. It has a form factor of 13x13 mm and a size of 256-ball, 1.00 mm pitch.
Datasheet PDF
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