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K4B1G1646E-HCF8

DDR DRAM, 64MX16, 0.15ns, CMOS, PBGA96,

ISO14001 ISO9001 DUNS

Brands: SAMSUNG SEMICONDUCTOR INC

Mfr.Part #: K4B1G1646E-HCF8

Datasheet: K4B1G1646E-HCF8 Datasheet (PDF)

Package/Case: FBGA96

Product Type: DRAMs

RoHS Status:

Stock Condition: 6554 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for K4B1G1646E-HCF8 or email to us: Email: [email protected], we will contact you within 12 hours.

Ovaga has a large stock of K4B1G1646E-HCF8 DRAMs from SAMSUNG SEMICONDUCTOR INC and we guarantee that they are original,brand new parts sourced directly from SAMSUNG SEMICONDUCTOR INC We can provide quality testing reports for K4B1G1646E-HCF8 upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.

Specifications

Parameter Value Parameter Value
Pbfree Code Yes Rohs Code Yes
Part Life Cycle Code Obsolete Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Reach Compliance Code ECCN Code EAR99
HTS Code 8542.32.00.32 Access Time-Max 0.15 ns
Clock Frequency-Max (fCLK) 533 MHz I/O Type COMMON
Interleaved Burst Length 4,8 JESD-30 Code R-PBGA-B96
JESD-609 Code e1 Memory Density 1073741824 bit
Memory IC Type DDR3 DRAM Memory Width 16
Moisture Sensitivity Level 3 Number of Terminals 96
Number of Words 67108864 words Number of Words Code 64000000
Organization 64MX16 Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY Package Code FBGA
Package Equivalence Code BGA96,9X16,32 Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Refresh Cycles 8192
Sequential Burst Length 4,8 Standby Current-Max 0.01 A
Supply Current-Max 0.2 mA Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES Technology CMOS
Terminal Finish TIN SILVER COPPER Terminal Form BALL
Terminal Pitch 0.8 mm

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The K4B1G1646E-HCF8 is a 1Gb DDR3 SDRAM chip manufactured by Samsung. It features a high-speed data transfer rate of up to 1600 Mbps and operates at a voltage of 1.5V. This chip is commonly used in electronic devices such as computers, laptops, and servers to provide reliable and fast memory performance.
  • Equivalent

    The equivalent products of the K4B1G1646E-HCF8 chip are Samsung K4B1G1646E-BCH9, SK Hynix H5TC2G83CFR-RDA, and Micron MT41J128M16HA-125.
  • Features

    The K4B1G1646E-HCF8 is a 1Gb DDR3 SDRAM chip with a 64Mx16 configuration and a clock frequency of 800MHz. It operates at a voltage of 1.5V and has a data transfer rate of 1600Mbps. This chip is ideal for use in various electronic devices such as laptops, desktops, and servers.
  • Pinout

    The K4B1G1646E-HCF8 is a 1Gb DDR3 SDRAM with a 96-ball FBGA package. It has a pin count of 96 and is commonly used in memory modules for computing devices.
  • Manufacturer

    Samsung is the manufacturer of K4B1G1646E-HCF8. Samsung is a South Korean multinational conglomerate company that specializes in various sectors, including electronics, finance, and construction. As one of the largest technology companies in the world, Samsung produces a wide range of products such as smartphones, televisions, memory chips, and home appliances.
  • Application Field

    The K4B1G1646E-HCF8 is a 4Gb DDR3 SDRAM chip commonly used in computer systems, networking equipment, and other electronic devices requiring high-speed memory. It is suitable for applications such as desktops, laptops, servers, graphics cards, and embedded systems, providing fast and reliable performance for data processing and storage.
  • Package

    The K4B1G1646E-HCF8 chip is a DDR3 SDRAM (Synchronous Dynamic Random Access Memory) in a FBGA (Fine-pitch Ball Grid Array) package with a 78-ball form. It features a 1Gbit capacity organized as 128Mbit x 8.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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