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K4S561632E-TC75
The K4S561632E-TC75 is a high-density dynamic random access memory (DRAM) chip from Samsung
Brands: Samsung Electronics
Mfr.Part #: K4S561632E-TC75
Datasheet: K4S561632E-TC75 Datasheet (PDF)
Package/Case: TSOP-II
RoHS Status:
Stock Condition: 7813 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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The K4S561632E-TC75 is a high-density dynamic random access memory (DRAM) chip from Samsung. It has a capacity of 256 megabits and operates with a clock frequency of 133 MHz. The chip supports burst mode operations and low-power self-refresh mode, making it suitable for use in a range of devices, including desktop computers, laptops, and embedded systems.
Features
- Low power consumption
- Fast data access time
- Extended temperature range
- Synchronous dynamic RAM (SDRAM)
- 167 MHz clock frequency
- 4M x 16-bits x 4 banks organization
- Double-data-rate architecture
- Operates from a single +3.3V power supply
Application
- Personal computers
- Laptops
- Tablets
- Smartphones
- Digital cameras
- MP3 players
- Printers
- Video game consoles
- Networking equipment
- Medical devices
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| ECCN (US) | EAR99 | Part Status | Obsolete |
| Automotive | No | PPAP | No |
| DRAM Type | SDRAM | Chip Density (bit) | 256M |
| Organization | 16Mx16 | Number of Internal Banks | 4 |
| Number of Words per Bank | 4M | Number of Bits/Word (bit) | 16 |
| Data Bus Width (bit) | 16 | Maximum Clock Rate (MHz) | 133 |
| Maximum Access Time (ns) | 6|5.4 | Address Bus Width (bit) | 15 |
| Process Technology | CMOS | Interface Type | LVTTL |
| Minimum Operating Supply Voltage (V) | 3 | Maximum Operating Supply Voltage (V) | 3.6 |
| Operating Current (mA) | 130 | Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 70 | Supplier Temperature Grade | Commercial |
| Number of I/O Lines (bit) | 16 | Packaging | Tape and Reel |
| Mounting | Surface Mount | Package Height | 1 |
| Package Width | 10.16 | Package Length | 22.62(Max) |
| PCB changed | 54 | Standard Package Name | SO |
| Supplier Package | TSOP-II | Pin Count | 54 |
| Lead Shape | Gull-wing |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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![Product]( "Product")
Step1 :Product
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![Vacuum packaging]( "Vacuum packaging")
Step2 :Vacuum packaging
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![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
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![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
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![Packaging boxes]( "Packaging boxes")
Step5 :Packaging boxes
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![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The K4S561632E-TC75 is a type of dynamic random-access memory (DRAM) chip commonly used in computer systems and electronic devices. It has a capacity of 256 Megabits and operates at a speed of 133 Megahertz. The chip is designed to provide fast and reliable data storage and retrieval, making it suitable for various applications including gaming consoles, networking equipment, and industrial systems.
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Equivalent
Some possible equivalent products of the K4S561632E-TC75 chip are: Micron MT48LC16M16A2P-75:C, Samsung K4S561633E-UC75, and Hynix HY5DU121622CTP-D43. -
Features
The K4S561632E-TC75 is a synchronous dynamic random-access memory (SDRAM) module with a capacity of 256MB. It operates at 143MHz (CAS latency of 3) and uses a 4Mx16 bit organization. It has a 3.3V power supply and supports a burst read/write and refresh cycles. -
Pinout
The K4S561632E-TC75 is a 512Mb synchronous dynamic random-access memory (SDRAM) module. It has a pin count of 66, consisting of 33 input/output pins. The module serves as a high-speed volatile memory used in various electronic devices like computers, printers, and routers. -
Manufacturer
Samsung Electronics is the manufacturer of the K4S561632E-TC75. Samsung Electronics is a multinational conglomerate company based in South Korea. It is known for producing a wide range of electronic devices, including mobile phones, televisions, home appliances, and memory chips. -
Application Field
The K4S561632E-TC75 is a 256Mb synchronous DRAM (SDRAM) chip commonly used in computer systems, networking equipment, and communication devices. This chip is suitable for applications such as desktops, laptops, routers, switches, and set-top boxes, where high-speed data transfer and memory storage are required. -
Package
The K4S561632E-TC75 chip is a memory module package type with a TSOP2 form factor. It has a size of 10.16mm x 17.01mm.
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