K4G80325FB-HC25
Standard Package
Brands: Samsung
Mfr.Part #: K4G80325FB-HC25
Datasheet: K4G80325FB-HC25 Datasheet (PDF)
Package/Case: FBGA
Product Type: DRAMs
RoHS Status:
Stock Condition: 6554 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomOvaga has a large stock of K4G80325FB-HC25 DRAMs from Samsung and we guarantee that they are original,brand new parts sourced directly from Samsung We can provide quality testing reports for K4G80325FB-HC25 upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.
Specifications
Parameter | Value | Parameter | Value |
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Manufacturer | Samsung |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The K4G80325FB-HC25 is a specific model of Samsung DRAM chip commonly used in various electronic devices for memory storage and processing capabilities. It offers high performance, reliability, and energy efficiency, making it a popular choice for applications such as smartphones, tablets, and computers.
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Equivalent
The equivalent products of the K4G80325FB-HC25 chip are the MTA8ATF1G64HZ-2G6 and MT40A2G8SA-062E chips. These chips have the same specifications and are compatible replacements for the K4G80325FB-HC25 chip. -
Features
1. DDR4 SDRAM technology 2. 4 Gigabit capacity 3. 1.2V voltage 4. High-speed data transfer rate 5. Low power consumption 6. RoHS compliant 7. High reliability and stability 8. Operating temperature range of -40°C to 95°C -
Pinout
The K4G80325FB-HC25 is a 32Mb SDRAM with a 54-pin TSOP-II package. It has a data transfer rate of 133MHz and operates at 3.3V. The device functions as a high-density memory chip primarily used in networking, telecommunications, and industrial applications. -
Manufacturer
Samsung is the manufacturer of the K4G80325FB-HC25. Samsung is a South Korean multinational conglomerate company that specializes in various sectors such as consumer electronics, IT services, telecommunications, and semiconductors. The company is one of the largest and most reputable electronics manufacturers in the world. -
Application Field
The K4G80325FB-HC25 is commonly used in high-performance computing, data centers, artificial intelligence, and machine learning applications. It is also suitable for networking equipment, automotive electronics, and other advanced technologies that require high-speed and high-density memory solutions. -
Package
The K4G80325FB-HC25 chip has a packaging type of BGA (Ball Grid Array), a form factor of FBGA (Fine-pitch Ball Grid Array), and a size of 8Gb (1Gx8).
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products