Altera EPM570F256C3N

Part points

• The EPM570F256C3N is a flash-based FPGA chip from Intel, offering 570,000 logic elements, 22,908 logic array blocks, and 336 user I/Os. It features 256 kilobits of embedded memory, integrated PLLs, and consumes low power. This chip is ideal for applications requiring high-performance logic and memory functionality in a compact package.

• Equivalent

  The equivalent products of EPM570F256C3N chip are Altera Cyclone 10 LP, Intel Cyclone 10 LP, and Altera MAX II. They are all low-power, high-performance programmable logic devices that offer features similar to the EPM570F256C3N chip, such as a large number of logic elements, embedded memory blocks, and support for various I/O standards.

• Features

  The EPM570F256C3N is a low-cost FPGA device from the MAX II family with 570 Logic Elements (LEs), 3818 bits of embedded memory, and 66 user I/Os. It operates at a speed grade of 3 and has 256 Kbits of flash memory for configuration storage.

• Pinout

  The EPM570F256C3N has a pin count of 256 pins and is a field-programmable gate array (FPGA). Its functions include logic functions, memory blocks, and I/O pins for programmable customization of digital circuits in various applications such as communication systems, industrial controls, and automotive electronics.

• Manufacturer

  The manufacturer of the EPM570F256C3N is Altera Corporation. It is a semiconductor company specializing in programmable logic devices, complex programmable logic devices (CPLDs), field-programmable gate arrays (FPGAs), and system-on-a-chip solutions. Altera was acquired by Intel Corporation in 2015 and is now part of Intel's Programmable Solutions Group.

• Application Field

  The EPM570F256C3N is commonly used in a variety of applications such as industrial automation, automotive electronics, communications equipment, consumer electronics, and medical devices. It is particularly well-suited for applications that require high performance, low power consumption, and reliable operation in harsh environments.

• Package

  The EPM570F256C3N chip comes in a surface-mount 256-pin FBGA (Fine-pitch Ball Grid Array) package. It has a form factor of 17mm x 17mm and a size of 256 pins.