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Altera EP2SGX90EF1152C3N

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ISO14001 ISO9001 DUNS

Brands: Intel

Mfr.Part #: EP2SGX90EF1152C3N

Datasheet: EP2SGX90EF1152C3N Datasheet (PDF)

Package/Case: FBGA-1152

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3028 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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EP2SGX90EF1152C3N General Description

The EP2SGX90EF1152C3N is a member of the Stratix II GX family of field-programmable gate arrays (FPGAs) manufactured by Altera. It is a high-performance FPGA designed for applications that require large amounts of logic, memory, and high-speed serial interfaces.The EP2SGX90EF1152C3N features 115,200 logic elements, 6.3 Mb of RAM, and 2,287 embedded 18 x 18 multipliers. It also includes a variety of high-speed transceivers, including 20 RocketIO™ transceivers, which support a wide range of serial protocols such as Gigabit Ethernet, PCI Express, and Serial RapidIO.This FPGA is built on a 90nm process technology, allowing for high performance and low power consumption. It operates at speeds of up to 500 MHz, making it suitable for a wide range of applications that require fast data processing.In addition to its high-performance capabilities, the EP2SGX90EF1152C3N also features a range of security features to protect designs from unauthorized access or tampering. These include flash-based encryption, secure device management, and physical security features to prevent reverse engineering or cloning.

ep2sgx90ef1152c3n

Features

  • High-performance FPGA with 1152K logic elements
  • Embedded Dual-Core ARM Cortex-A9 32-bit hard processors
  • Integrated IP Blocks such as PCIe, DDR3, and Ethernet
  • Support for DDR3 memory up to 533MHz
  • Operates at a maximum speed of 915 MHz
  • Capable of running advanced applications with low power consumption
ep2sgx90ef1152c3n

Application

  • High-performance computing
  • Networking
  • Data center applications
  • Telecommunications
  • Industrial automation
  • High-speed data processing
  • Video processing and streaming
  • Medical imaging
  • Satellite communications
  • Security and surveillance systems
Intel Inventory

Specifications

Parameter Value Parameter Value
Product Category FPGA - Field Programmable Gate Array Shipping Restrictions This product may require additional documentation to export from the United States.
Series Stratix II GX EP2SGX90E Number of Logic Elements 90960 LE
Adaptive Logic Modules - ALMs 36384 ALM Embedded Memory 4.31 Mbit
Number of I/Os 558 I/O Supply Voltage - Min 1.2 V
Supply Voltage - Max 1.2 V Minimum Operating Temperature 0 C
Maximum Operating Temperature + 70 C Data Rate 600 Mb/s to 6.375 Gb/s
Number of Transceivers 12 Transceiver Mounting Style SMD/SMT
Package / Case FBGA-1152 Brand Intel / Altera
Moisture Sensitive Yes Number of Logic Array Blocks - LABs 4548 LAB
Operating Supply Current 620 mA Operating Supply Voltage 1.2 V
Product Type FPGA - Field Programmable Gate Array Factory Pack Quantity 24
Subcategory Programmable Logic ICs Total Memory 4520448 bit
Tradename Stratix II GX

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP2SGX90EF1152C3N chip is a field-programmable gate array (FPGA) manufactured by Intel. It features 90,000 logic elements, 4.2 Mb of RAM, and 316 user I/Os. The chip is designed for high-performance applications in areas such as telecommunications, industrial automation, and medical devices.
  • Equivalent

    Some equivalent products to the EP2SGX90EF1152C3N chip include EP2SGX90FF1508C3, EP2SGX90FF1508I3, and EP2SGX90FF1508C5. These chips are from the same product family and have similar specifications, such as a similar number of logic elements and transceivers.
  • Features

    Some features of EP2SGX90EF1152C3N include a maximum capacity of 115,200 logic elements, 2,304 embedded memory blocks, 6,912 embedded multipliers, and up to 1,152 user I/Os. It also supports various communication protocols such as PCIe, Ethernet, and JTAG, making it suitable for a wide range of applications.
  • Pinout

    The EP2SGX90EF1152C3N has a pin count of 1152 and is a field-programmable gate array (FPGA) with a maximum capacity of 89,856 logic elements. This device is designed for high-performance applications in sectors such as telecommunications, networking, and computing.
  • Manufacturer

    The EP2SGX90EF1152C3N is manufactured by Intel Corporation, an American multinational corporation that produces semiconductor chips and other computer technology-related products. Intel is a leading producer of microprocessors for computing devices and is one of the largest and most influential technology companies in the world.
  • Application Field

    The EP2SGX90EF1152C3N is a high-performance FPGA that is commonly used in applications such as telecommunications, networking, automotive, industrial automation, and military/aerospace systems. It provides significant processing power and flexibility to handle complex tasks such as data processing, encryption, and signal processing.
  • Package

    The EP2SGX90EF1152C3N chip is packaged in a 1152-pin FineLine BGA form factor with a size of 35mm x 35mm.

Datasheet PDF

Preliminary Specification EP2SGX90EF1152C3N PDF Download

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