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Altera EPM2210F256C5N
Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256
Brands: Altera Corporation (Intel)
Mfr.Part #: EPM2210F256C5N
Datasheet: EPM2210F256C5N Datasheet (PDF)
Package/Case: FBGA-256
RoHS Status:
Stock Condition: 3615 pcs, New Original
Product Type: Programmable Logic ICs
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $13.543 | $13.543 |
| 10 | $13.071 | $130.710 |
| 30 | $12.253 | $367.590 |
| 100 | $11.538 | $1153.800 |
In Stock:3615 PCS
EPM2210F256C5N General Description
CPLD, MAX II, 2210 ELEMENTS, 256FBGA; CPLD Type: FLASH; No. of Macrocells: 1700; No. of I/O's: 204I/O's; Logic Case Style: BGA; No. of Pins: 256Pins; Frequency: 304MHz; Supply Voltage Min: 3V; Supply Voltage Max: 3.6V; Propagation Delay: 7.5ns; Global Clock Setup Time: 1.2ns; Operating Temperature Min: 0°C; Operating Temperature Max: 85°C; Product Range: MAX II Series; MSL: MSL 3 - 168 hours; SVHC: No SVHC (17-Dec-2015); I/O Interface Standard: LVCMOS, LVTTL, PCI; IC Temperature Range: Commercial; Logic IC Base Number: EPM2210F; Logic IC Function: CPLD; Operating Temperature Range: 0°C to +85°C; Programmable Logic Type: CPLD; Supply Voltage Range: 3V to 3.6V; Termination Type: Surface Mount Device
Features
- It has 256,000 logic elements.
- It operates at a maximum frequency of 350 MHz.
- It has 4,608 Kbits of embedded memory.
- It has 344 user I/O pins.
- It operates with a voltage range of 1.2V to 3.3V.
Application
- Industrial automation
- Communications equipment
- Medical equipment
- Aerospace and defense systems
- Test and measurement equipment
- High-performance computing systems
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| feature-family-name | MAX® II | feature-device-logic-cells | 2210 |
| feature-program-memory-type | Flash | feature-memory-size-kbit | 8 |
| feature-ram-bits-kbit | feature-number-of-logic-blocks-elements | 221 | |
| feature-number-of-macro-cells | 1700 | feature-number-of-product-terms-per-macro | |
| feature-process-technology | 0.18um | feature-device-system-gates | |
| feature-number-of-user-i-os | 204 | feature-number-of-flip-flops | |
| feature-programmability | Yes | feature-programmable-type | In System Programmable |
| feature-maximum-internal-frequency-mhz | feature-speed-grade | 5 | |
| feature-in-system-programmability | Yes | feature-minimum-operating-supply-voltage-v | 2.375 |
| feature-maximum-operating-supply-voltage-v | 3.6 | feature-packaging | Tray |
| feature-rad-hard | feature-pin-count | 256 | |
| feature-supplier-package | FBGA | feature-standard-package-name1 | BGA |
| feature-cecc-qualified | No | feature-esd-protection | Yes |
| feature-military | No | feature-aec-qualified | No |
| feature-aec-qualified-number | feature-auto-motive | No | |
| feature-p-pap | No | feature-eccn-code | 3A991 |
| feature-svhc | No |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The EPM2210F256C5N chip is a field-programmable gate array (FPGA) device from Intel. It offers 256,000 logic elements and various I/O features, making it capable of implementing complex digital systems. It can be programmed and reprogrammed to meet specific application requirements. The chip is versatile and suitable for a wide range of applications, including telecommunications, industrial automation, and image processing.
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Features
The EPM2210F256C5N is a Field Programmable Gate Array (FPGA) device manufactured by Intel. It has 256k logic elements, embedded memory, and supports low-cost FPGA applications. It operates at a voltage of 5V and has 312 user I/O pins, making it suitable for a wide range of digital design applications. -
Pinout
The EPM2210F256C5N is a field-programmable gate array (FPGA) with a pin count of 256. It is used for digital logic and signal processing applications in various electronic systems. -
Manufacturer
Altera Corporation, now known as Intel FPGA, is the manufacturer of the EPM2210F256C5N. It is a semiconductor company that specializes in programmable logic devices and associated software tools. Intel FPGA offers a range of products for various industries, including automotive, networking, and data centers, enabling customers to design and develop innovative solutions. -
Application Field
The EPM2210F256C5N, a field programmable gate array (FPGA) from Intel, is commonly used in embedded systems, industrial automation, communication systems, and automotive applications. Its features like low power consumption, high performance, and flexibility make it suitable for a wide range of applications in these areas. -
Package
The EPM2210F256C5N chip has a package type of FBGA, form factor of BGA (Ball Grid Array), and its size is 15mm x 15mm.
Datasheet PDF
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