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Altera EP4CGX50CF23C8N
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 2562048 49888 484-BGA
Brands: Altera Corporation (Intel)
Mfr.Part #: EP4CGX50CF23C8N
Datasheet: EP4CGX50CF23C8N Datasheet (PDF)
Package/Case: FBGA-484
Product Type: Programmable Logic ICs
EP4CGX50CF23C8N General Description
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 2562048 49888 484-BGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pin Count | 484 | Package Category | BGA |
| Released Date | Nov 12, 2019 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The EP4CGX50CF23C8N is a member of the Altera Cyclone IV series of Field Programmable Gate Arrays (FPGAs). It features 50,000 Logic Elements, 2,892 Kbits of RAM, and numerous I/O options. This chip is ideal for a wide range of applications requiring programmable logic solutions.
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Equivalent
Some equivalent products of the EP4CGX50CF23C8N chip are Altera EP4CE55F23I7N, Xilinx Spartan-6 XC6SLX45-2FGG484C, and Lattice ECP5-5G-85C7N. These chips offer similar capabilities and performance characteristics that can be used as alternatives to the EP4CGX50CF23C8N in certain applications. -
Features
- Low-cost and low-power FPGA - Offers 49,152 logic elements - Includes up to 1,375 Kbits of RAM - Provides 233 user I/O pins - Contains 176 embedded multipliers - Supports 3.3V operation - Features 2.5V / 3.3V / 1.2V power supplies -
Pinout
The EP4CGX50CF23C8N is a 208-pin FPGA (Field-Programmable Gate Array) with 50,000 logic elements. Its functions include programmable logic blocks, RAM blocks, PLLs (Phase-Locked Loops), and hard IP blocks for SERDES (Serializer/Deserializer) communication. It also offers high-speed I/O interfaces and low power consumption. -
Manufacturer
The EP4CGX50CF23C8N is manufactured by Intel. Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. They are one of the largest and leading manufacturers of computer microprocessors and other semiconductor products. Intel is known for its innovations in the technology industry and is a major player in the global market. -
Application Field
The EP4CGX50CF23C8N is a low-cost FPGA ideal for applications such as industrial automation, automotive electronics, communication systems, and consumer electronics. It provides high-performance and flexibility for designs requiring moderate logic density and I/O capabilities. -
Package
The EP4CGX50CF23C8N chip comes in a BGA (Ball Grid Array) package, has a form factor of 23x23 mm, and a size of 484 solder balls for connection to a PCB.
Datasheet PDF
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