Altera EP4CGX110CF23C8N
FPGA Cyclone® IV GX Family 109424 Cells 60nm Technology 1.2V 484-Pin FBGA
Brands: Altera Corporation (Intel)
Mfr.Part #: EP4CGX110CF23C8N
Datasheet: EP4CGX110CF23C8N Datasheet (PDF)
Package/Case: FBGA-484
RoHS Status:
Stock Condition: 3095 pcs, New Original
Product Type: Programmable Logic ICs
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $122.150 | $122.150 |
30 | $116.944 | $3508.320 |
In Stock:3095 PCS
EP4CGX110CF23C8N General Description
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 270 5621760 109424 484-BGA
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
feature-family-name | Cyclone® IV GX | feature-process-technology | 60nm |
feature-maximum-number-of-user-i-os | 270 | feature-number-of-registers | |
feature-device-logic-cells | 109424 | feature-device-system-gates | |
feature-number-of-multipliers | 280 (18x18) | feature-program-memory-type | SRAM |
feature-ram-bits-kbit | 5490 | feature-total-number-of-block-ram | 610 |
feature-ethernet-macs | feature-supported-ip-core | Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Sub-frame Latency JPEG 2000 Encoder (BA130)|PCI Express to AXI Bridge Controller (GPEX-PAB)|ISA/PC Card/PCMCIA/Compact Flash Host Adapter | |
feature-supported-ip-core-manufacture | Altera/CAST, Inc/Barco Silex/Mobiveil, Inc/Eureka Technology Inc | feature-maximum-number-of-serdes-channels | |
feature-device-logic-units | 109424 | feature-device-number-of-dlls-plls | 4 |
feature-transceiver-blocks | 8 | feature-transceiver-speed-gbps | 3.125 |
feature-dedicated-dsp | feature-pci-blocks | 1 | |
feature-programmability | Yes | feature-maximum-internal-frequency-mhz | |
feature-speed-grade | 8 | feature-giga-multiply-accumulates-per-second | |
feature-differential-i-o-standards-supported | B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL | feature-single-ended-i-o-standards-supported | LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL |
feature-external-memory-interface | DDR2 SDRAM|QDRII+SRAM | feature-minimum-operating-supply-voltage-v | 1.16 |
feature-maximum-operating-supply-voltage-v | 1.24 | feature-packaging | |
feature-rohs | feature-rad-hard | ||
feature-pin-count | 484 | feature-supplier-package | FBGA |
feature-standard-package-name1 | BGA | feature-cecc-qualified | No |
feature-esd-protection | feature-escc-qualified | ||
feature-military | No | feature-aec-qualified | No |
feature-aec-qualified-number | feature-auto-motive | No | |
feature-p-pap | No | feature-eccn-code | 3A991 |
feature-svhc | No |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The EP4CGX110CF23C8N chip is a field-programmable gate array (FPGA) produced by Intel. It belongs to the Cyclone IV GX series and offers 110,000 logic elements (LEs) along with a range of features for various applications. With its high-performance capabilities, the chip can be programmatically configured to fit different needs in industries such as telecommunications, automotive, and aerospace.
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Equivalent
Equivalent products of the EP4CGX110CF23C8N chip include EP4CGX110CF23I7N, EP4CGX110CF23I8N, EP4CGX110BF23I7N, EP4CGX110BF23I8N, EP4CGX110DF23I7N, and EP4CGX110DF23I8N. -
Features
The EP4CGX110CF23C8N is an FPGA device from the Cyclone IV GX family by Intel. It offers a capacity of 110,000 logic elements, 6.5 Mbits of RAM, and 317 user I/Os. It supports high-speed serial transceivers, has low power consumption, and is suitable for a wide range of applications, including communication, industrial automation, and video processing. -
Pinout
The EP4CGX110CF23C8N is an FPGA device with 110,000 logic elements. It has a pin count of 484 and is designed for general-purpose applications. The specific pin functions and configuration will depend on the application and the user's design requirements. -
Manufacturer
The manufacturer of the EP4CGX110CF23C8N is Intel. Intel is a multinational technology company that designs and manufactures advanced computer processing units and other related products. It is known for its processors used in personal computers, servers, and a wide range of electronic devices. -
Application Field
The EP4CGX110CF23C8N is a field-programmable gate array (FPGA) from Intel. It can be used in a wide range of application areas, including aerospace and defense, automotive, industrial automation, telecommunications, and high-performance computing. It offers high logic density, high-speed transceivers, and advanced DSP capabilities, making it suitable for various complex and demanding applications. -
Package
The EP4CGX110CF23C8N chip is available in a plastic Ball Grid Array (BGA) package with a size of 23 x 23 mm and 484 balls.
Datasheet PDF
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