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Altera EP3C25F324C8N
FPGA Cyclone® III Family 24624 Cells 402MHz 65nm Technology 1.2V 324-Pin FBGA
Brands: Altera Corporation (Intel)
Mfr.Part #: EP3C25F324C8N
Datasheet: EP3C25F324C8N Datasheet (PDF)
Package/Case: FBGA-324
Product Type: Programmable Logic ICs
EP3C25F324C8N General Description
Field Programable Gate Array(FPGA) IC; No. of Logic Blocks:1539; Logic Family:Cyclone III; Series:Cyclone III; No. of I/O's:215; I/O Supply Voltage:3.3V; Operating Frequency Max:402MHz; Operating Temperature Range:0°C to +85°C ;RoHS Compliant: Yes
Features
- FPGA family: Cyclone III
- Package type: FBGA (Fine-pitch Ball Grid Array)
- Package size: 324 balls
- Number of logic elements: 24,624
- Number of embedded multipliers: 112
- Maximum user I/O pins: 212
- On-chip memory: 288 kilobits (Kb)
- Operating voltage: 1.2V
- Speed grade: C8 (commercial grade)
Application
- Industrial automation and control
- Communication systems
- Embedded systems
- Video and image processing
- Aerospace and defense
- High-performance computing
- Medical devices
- Automotive electronics
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| feature-family-name | Cyclone® III | feature-process-technology | 65nm |
| feature-maximum-number-of-user-i-os | 215 | feature-number-of-registers | |
| feature-device-logic-cells | 24624 | feature-device-system-gates | |
| feature-number-of-multipliers | 66 (18x18) | feature-program-memory-type | SRAM |
| feature-ram-bits-kbit | 594 | feature-total-number-of-block-ram | 66 |
| feature-ethernet-macs | feature-supported-ip-core | Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V1 ColdFire|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|10 Gigabit Ethernet MAC|32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz | |
| feature-supported-ip-core-manufacture | Altera/Freescale/CAST, Inc/MorethanIP/PLDA | feature-maximum-number-of-serdes-channels | |
| feature-device-logic-units | 24624 | feature-device-number-of-dlls-plls | 4 |
| feature-transceiver-blocks | feature-transceiver-speed-gbps | ||
| feature-dedicated-dsp | feature-pci-blocks | ||
| feature-programmability | No | feature-maximum-internal-frequency-mhz | 402 |
| feature-speed-grade | 8 | feature-giga-multiply-accumulates-per-second | |
| feature-differential-i-o-standards-supported | LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS | feature-single-ended-i-o-standards-supported | LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL |
| feature-external-memory-interface | DDR2 SDRAM|QDRII+SRAM | feature-minimum-operating-supply-voltage-v | 1.15 |
| feature-maximum-operating-supply-voltage-v | 1.25 | feature-packaging | |
| feature-rohs | feature-rad-hard | ||
| feature-pin-count | 324 | feature-supplier-package | FBGA |
| feature-standard-package-name1 | BGA | feature-cecc-qualified | No |
| feature-esd-protection | feature-escc-qualified | ||
| feature-military | No | feature-aec-qualified | No |
| feature-aec-qualified-number | feature-auto-motive | No | |
| feature-p-pap | No | feature-eccn-code | 3A991 |
| feature-svhc | Yes |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The EP3C25F324C8N chip is a programmable logic device (PLD) manufactured by Altera (now Intel). It belongs to the Cyclone III family of FPGAs and offers 25,040 LEs (logic elements) and 324 I/O pins. It features low power consumption and high speed performance, making it suitable for various applications such as telecommunications, automotive, and industrial sectors.
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Equivalent
The equivalent products of the EP3C25F324C8N chip are the EP3C25F324I7N, EP3C25F324C7N, and EP3C25U324I7N chips. -
Features
The EP3C25F324C8N is a programmable logic device (PLD) from the Cyclone III family by Altera. It has a capacity of 25,856 logic elements, 324 user I/O pins, and operates at a maximum frequency of 420 MHz. The device supports high-speed digital systems and is designed for applications requiring low power consumption. -
Pinout
The EP3C25F324C8N is an Altera Cyclone III family FPGA with a pin count of 324 and comes in an 8x8 mm2 package. It features various functions including programmable logic, memory, and embedded digital signal processing (DSP) capabilities. -
Manufacturer
The EP3C25F324C8N is manufactured by Altera Corporation. Altera is a fabless semiconductor company that specializes in programmable logic devices (PLDs), such as field-programmable gate arrays (FPGAs). They are known for providing customizable solutions for various industries including telecommunications, automotive, industrial automation, and consumer electronics. -
Application Field
The EP3C25F324C8N is a member of the field-programmable gate array (FPGA) family and can be used in various applications such as industrial automation, telecommunications, medical equipment, video and image processing, automotive systems, aerospace, and defense. It is suitable for tasks that require high-speed data processing, complex logic functionality, and reprogrammability. -
Package
The EP3C25F324C8N chip comes in the FineLine BGA (Ball grid array) package type. It has a 1 mm pitch and is available in a size of 324 balls.
Datasheet PDF
Key points
-
The EP3C25F324C8N chip is a programmable logic device (PLD) manufactured by Altera (now Intel). It belongs to the Cyclone III family of FPGAs and offers 25,040 LEs (logic elements) and 324 I/O pins. It features low power consumption and high speed performance, making it suitable for various applications such as telecommunications, automotive, and industrial sectors.
-
Equivalent
The equivalent products of the EP3C25F324C8N chip are the EP3C25F324I7N, EP3C25F324C7N, and EP3C25U324I7N chips. -
Features
The EP3C25F324C8N is a programmable logic device (PLD) from the Cyclone III family by Altera. It has a capacity of 25,856 logic elements, 324 user I/O pins, and operates at a maximum frequency of 420 MHz. The device supports high-speed digital systems and is designed for applications requiring low power consumption. -
Pinout
The EP3C25F324C8N is an Altera Cyclone III family FPGA with a pin count of 324 and comes in an 8x8 mm2 package. It features various functions including programmable logic, memory, and embedded digital signal processing (DSP) capabilities. -
Manufacturer
The EP3C25F324C8N is manufactured by Altera Corporation. Altera is a fabless semiconductor company that specializes in programmable logic devices (PLDs), such as field-programmable gate arrays (FPGAs). They are known for providing customizable solutions for various industries including telecommunications, automotive, industrial automation, and consumer electronics. -
Application Field
The EP3C25F324C8N is a member of the field-programmable gate array (FPGA) family and can be used in various applications such as industrial automation, telecommunications, medical equipment, video and image processing, automotive systems, aerospace, and defense. It is suitable for tasks that require high-speed data processing, complex logic functionality, and reprogrammability. -
Package
The EP3C25F324C8N chip comes in the FineLine BGA (Ball grid array) package type. It has a 1 mm pitch and is available in a size of 324 balls.
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