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Altera EP3C120F780C8
FPGA Cyclone® III Family 119088 Cells 402MHz 65nm Technology 1.2V 780-Pin FBGA
Brands: Altera Corporation (Intel)
Mfr.Part #: EP3C120F780C8
Datasheet: EP3C120F780C8 Datasheet (PDF)
Package/Case: FBGA-780
RoHS Status:
Stock Condition: 3860 pcs, New Original
Product Type: Programmable Logic ICs
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $2475.808 | $2475.808 |
| 216 | $987.865 | $213378.840 |
| 504 | $954.853 | $481245.912 |
| 1008 | $938.542 | $946050.336 |
In Stock:3860 PCS
EP3C120F780C8 General Description
Cyclone® III Field Programmable Gate Array (FPGA) IC 531 3981312 119088 780-BGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| feature-family-name | Cyclone® III | feature-process-technology | 65nm |
| feature-maximum-number-of-user-i-os | 531 | feature-number-of-registers | |
| feature-device-logic-cells | 119088 | feature-device-system-gates | |
| feature-number-of-multipliers | 288 (18x18) | feature-program-memory-type | SRAM |
| feature-ram-bits-kbit | 3888 | feature-total-number-of-block-ram | 432 |
| feature-ethernet-macs | feature-supported-ip-core | Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V1 ColdFire|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|10 Gigabit Ethernet MAC|32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz | |
| feature-supported-ip-core-manufacture | Altera/Freescale/CAST, Inc/MorethanIP/PLDA | feature-maximum-number-of-serdes-channels | |
| feature-device-logic-units | 119088 | feature-device-number-of-dlls-plls | 4 |
| feature-transceiver-blocks | feature-transceiver-speed-gbps | ||
| feature-dedicated-dsp | feature-pci-blocks | ||
| feature-programmability | No | feature-maximum-internal-frequency-mhz | 402 |
| feature-speed-grade | 8 | feature-giga-multiply-accumulates-per-second | |
| feature-differential-i-o-standards-supported | LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS | feature-single-ended-i-o-standards-supported | LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL |
| feature-external-memory-interface | DDR2 SDRAM|QDRII+SRAM | feature-minimum-operating-supply-voltage-v | 1.15 |
| feature-maximum-operating-supply-voltage-v | 1.25 | feature-packaging | |
| feature-rohs | feature-rad-hard | ||
| feature-pin-count | 780 | feature-supplier-package | FBGA |
| feature-standard-package-name1 | BGA | feature-cecc-qualified | No |
| feature-esd-protection | feature-escc-qualified | ||
| feature-military | No | feature-aec-qualified | No |
| feature-aec-qualified-number | feature-auto-motive | No | |
| feature-p-pap | No | feature-eccn-code | 3A991 |
| feature-svhc | Yes |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The EP3C120F780C8 chip is a field-programmable gate array (FPGA) manufactured by Altera (now Intel). It offers a high-density of programmable logic elements and embedded memory, making it suitable for a wide range of applications. The chip provides customizable digital logic functions, allowing designers to implement complex systems on a single device. It also supports advanced features like reconfiguration and partial reconfiguration.
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Equivalent
Some equivalent products of the EP3C120F780C8 chip are the EP3C120F780C6, EP3C120F780I7, EP3C120F780C6N, and the EP3C120F780C7 chips. -
Features
The EP3C120F780C8 is an FPGA (Field-Programmable Gate Array) from the Cyclone III family, with 120,000 logic elements and 3,888 Kbits of embedded memory. It has 8 differential signal channels and supports a maximum of 780 I/O pins. It operates at a maximum frequency of 416 MHz and offers various built-in features like PLLs, DLLs, and ADCs. -
Pinout
The EP3C120F780C8 is a field-programmable gate array (FPGA) with a pin count of 780. It offers various functions, including configurable logic blocks, embedded memory, multipliers, and high-speed transceivers. -
Manufacturer
The EP3C120F780C8 is manufactured by Intel Corporation. It is a multinational technology company specializing in the design and production of both hardware and software products. Intel is one of the world's largest semiconductor chip makers, serving various industries including computing, data center, IoT, and network infrastructure, among others. -
Application Field
The EP3C120F780C8 is a field-programmable gate array (FPGA) device predominantly used for applications in the aerospace, automotive, telecommunications, and industrial sectors. It can be integrated into systems requiring high-performance computing, signal processing, image and video processing, communication protocols, and control systems. -
Package
The EP3C120F780C8 chip is in a package type called FBGA (Fine-pitch Ball Grid Array), which has a form factor of 25x25 mm and a size of 780 balls.
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