Intel EP1S10F780C7N

Part points

• The EP1S10F780C7N chip is a high-performance field-programmable gate array (FPGA) developed by Altera (now Intel). It offers a wide variety of digital and analog functions and is designed for applications requiring high-speed processing, low power consumption, and high system integration. The chip can be reprogrammed to implement various functions and is commonly used in areas such as telecommunications, industrial automation, and automotive electronics.

• Equivalent

  Some equivalents of the EP1S10F780C7N chip include the EP1S10B672C7, EP1S20B672C7, EP1S30B672C7, and EP1S60B672C7.

• Features

  The EP1S10F780C7N is a field-programmable gate array (FPGA) by Altera. It has 10,570 logic elements, 250kbits of embedded memory, 16 PLLs, and 346 I/O pins. It operates at a maximum frequency of 341MHz and supports various standard interfaces such as PCI, Ethernet, and USB.

• Pinout

  The EP1S10F780C7N is an FPGA with a pin count of 780. The specific function of each pin can vary depending on the configuration and application of the FPGA. The datasheet provided by the manufacturer should be consulted for detailed information on pin assignments and functions.

• Manufacturer

  The manufacturer of the EP1S10F780C7N is Altera Corporation, now a part of Intel. Altera was a company focused on the design and production of programmable logic devices (PLDs), including field-programmable gate arrays (FPGAs). It provided solutions for various industries, including telecommunications, automotive, industrial automation, and military applications.

• Application Field

  The EP1S10F780C7N, a member of Altera's Stratix FPGA family, can be used in a variety of application areas. Some potential areas include telecommunications, data communication, industrial automation, aerospace and defense, and automotive. Its high-performance capabilities and extensive I/O capabilities make it suitable for complex systems that require advanced processing, connectivity, and functionality.

• Package

  The EP1S10F780C7N chip is available in a flip chip ball grid array (FCBGA) package form. It has a package size of 780 contact points and a package type of C7N.