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Intel 10M02SCM153I7G
FPGA MAX 10 Family 2000 Cells 55nm Technology 1.2V 153-Pin MBGA Tray
Brands: Intel Corp
Mfr.Part #: 10M02SCM153I7G
Datasheet: 10M02SCM153I7G Datasheet (PDF)
Package/Case: 153-VFBGA
RoHS Status:
Stock Condition: 3765 pcs, New Original
Product Type: Programmable Logic ICs
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $8.694 | $8.694 |
| 348 | $3.364 | $1170.672 |
| 696 | $3.246 | $2259.216 |
| 1044 | $3.189 | $3329.316 |
In Stock:3765 PCS
*Products eligible for online ordering ship within 1-2 business days,please contact us for exact shipping times.
10M02SCM153I7G General Description
MAX® 10 Field Programmable Gate Array (FPGA) IC 112 110592 2000 153-VFBGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| feature-family-name | MAX 10 | feature-process-technology | 55nm |
| feature-maximum-number-of-user-i-os | 112 | feature-number-of-registers | |
| feature-device-logic-cells | 2000 | feature-device-system-gates | |
| feature-number-of-multipliers | 16 (18x18) | feature-program-memory-type | SRAM |
| feature-ram-bits-kbit | 108 | feature-total-number-of-block-ram | |
| feature-ethernet-macs | feature-supported-ip-core | ||
| feature-supported-ip-core-manufacture | feature-maximum-number-of-serdes-channels | ||
| feature-device-logic-units | 2000 | feature-device-number-of-dlls-plls | 2 |
| feature-transceiver-blocks | feature-transceiver-speed-gbps | ||
| feature-dedicated-dsp | feature-pci-blocks | ||
| feature-programmability | Yes | feature-maximum-internal-frequency-mhz | |
| feature-speed-grade | 7 | feature-giga-multiply-accumulates-per-second | |
| feature-differential-i-o-standards-supported | HSUL|SSTL|LVDS | feature-single-ended-i-o-standards-supported | |
| feature-external-memory-interface | DDR3L SDRAM|DDR3 SDRAM|LPDDR2 SDRAM|DDR2 SDRAM | feature-minimum-operating-supply-voltage-v | 1.15 |
| feature-maximum-operating-supply-voltage-v | 1.25 | feature-packaging | Tray |
| feature-rohs | feature-rad-hard | ||
| feature-pin-count | 153 | feature-supplier-package | MBGA |
| feature-standard-package-name1 | BGA | feature-cecc-qualified | |
| feature-esd-protection | Yes | feature-escc-qualified | |
| feature-military | No | feature-aec-qualified | No |
| feature-aec-qualified-number | feature-auto-motive | No | |
| feature-p-pap | No | feature-eccn-code | EAR99 |
| feature-svhc | No |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The 10M02SCM153I7G chip is a programmable logic device (PLD) manufactured by Intel. It has 10,000 logic elements (LEs) and 253 kilobits (Kb) of embedded memory. The chip is fabricated using Intel's 10nm process technology, providing high-performance and low-power consumption capabilities. It is commonly used in a variety of applications, including automotive, industrial automation, and communications systems, for implementing complex digital logic functions.
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Pinout
The 10M02SCM153I7G is an Intel MAX 10 FPGA with 153 pins. Its functions include programmable logic, embedded memory, digital signal processing (DSP) blocks, and integrated analog-to-digital converters (ADC). -
Manufacturer
The manufacturer of the 10M02SCM153I7G is Intel. Intel is a multinational technology company that designs and manufactures microprocessors and other semiconductor components for the global computer industry. -
Application Field
The 10M02SCM153I7G is a specific component code that does not provide sufficient information to determine its application areas. -
Package
The 10M02SCM153I7G chip is in an FBGA (Fine-Pitch Ball Grid Array) package type. It has a form of 153-ball configuration and a size of 8mm x 8mm.
Datasheet PDF
Key points
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The 10M02SCM153I7G chip is a programmable logic device (PLD) manufactured by Intel. It has 10,000 logic elements (LEs) and 253 kilobits (Kb) of embedded memory. The chip is fabricated using Intel's 10nm process technology, providing high-performance and low-power consumption capabilities. It is commonly used in a variety of applications, including automotive, industrial automation, and communications systems, for implementing complex digital logic functions.
-
Pinout
The 10M02SCM153I7G is an Intel MAX 10 FPGA with 153 pins. Its functions include programmable logic, embedded memory, digital signal processing (DSP) blocks, and integrated analog-to-digital converters (ADC). -
Manufacturer
The manufacturer of the 10M02SCM153I7G is Intel. Intel is a multinational technology company that designs and manufactures microprocessors and other semiconductor components for the global computer industry. -
Application Field
The 10M02SCM153I7G is a specific component code that does not provide sufficient information to determine its application areas. -
Package
The 10M02SCM153I7G chip is in an FBGA (Fine-Pitch Ball Grid Array) package type. It has a form of 153-ball configuration and a size of 8mm x 8mm.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
The pricing is reasonable and competitive, and the products perform better than expected.