Xilinx XC6SLX75T-2FGG676C

Part points

• XC6SLX75T-2FGG676C is a field-programmable gate array (FPGA) chip made by Xilinx. It belongs to the Spartan-6 family and has a capacity of 75,000 logic cells. It is classified as speed grade 2, with a maximum operating frequency of 400 MHz. The chip is housed in a 676-pin fine-pitch ball grid array (FBGA) package. It provides flexible and customizable digital logic functionality for a wide range of applications.

• Equivalent

  The equivalent products of the XC6SLX75T-2FGG676C chip are the XC6SLX75-2FGG676C and XC6SLX75T-2CSG484C chips.

• Features

  The XC6SLX75T-2FGG676C is a Field-Programmable Gate Array (FPGA) with 74,880 logic cells, 4.8Mbits of distributed RAM, and 378 I/O pins. It operates at a maximum frequency of 450MHz and supports various I/O standards and protocols. It is designed for high-performance applications that require flexible and customizable logic circuits.

• Pinout

  The XC6SLX75T-2FGG676C is an FPGA with a pin count of 676. It is a member of the Spartan-6 LX family and has a speed grade of -2. The specific function of each pin can vary depending on the specific configuration and usage of the FPGA.

• Manufacturer

  The manufacturer of the XC6SLX75T-2FGG676C is Xilinx, Inc. Xilinx is a technology company specializing in the development and production of programmable devices and associated software tools. They are known for their field-programmable gate array (FPGA) and programmable logic device (PLD) solutions, offering flexible and customizable solutions for a wide range of applications in industries such as aerospace, automotive, telecommunications, and more.

• Application Field

  The XC6SLX75T-2FGG676C is a field programmable gate array (FPGA) chip used in various applications such as telecommunications, video and image processing, industrial automation, aerospace, and defense.

• Package

  The package type of the XC6SLX75T-2FGG676C chip is the FG676 package, the form is BGA (Ball Grid Array), and the size is 27mm x 27mm.