Images are for reference only See Product Specifications
Orders Over
$5000
Xilinx XC3S2000-4FGG456C
million 456-pin flip-chip ball grid array 90nm technology 630MHz operating frequency
Brands: Amd
Mfr.Part #: XC3S2000-4FGG456C
Datasheet: XC3S2000-4FGG456C Datasheet (PDF)
Package/Case: FBGA-456
RoHS Status:
Stock Condition: 2,708 pcs, New Original
Product Type: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $61.167 | $61.167 |
| 30 | $51.744 | $1552.320 |
In Stock: 2,708 PCS
XC3S2000-4FGG456C General Description
The XC3S2000-4FGG456C is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It belongs to the Spartan-3 family of FPGAs and has a density of 2 million system gates, making it suitable for a wide range of applications. This FPGA features 2000K system gates, 504KB block RAM, 316 user I/Os, and 267 I/O pins. It operates with a supply voltage of 1.14V to 1.26V and has a maximum operating frequency of 350MHz. The XC3S2000-4FGG456C also includes various features such as integrated PowerPC processors, multi-gigabit transceivers for high-speed serial communication, and digital signal processing blocks for implementing advanced signal processing algorithms.In terms of packaging, the XC3S2000-4FGG456C comes in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package, which provides a compact form factor and ensures reliable connections with other components on the PCB. This FPGA is RoHS compliant, ensuring that it meets environmentally friendly standards.
Features
- High-capacity FPGA with 2 million system gates
- 456-ball Fine Pitch Ball Grid Array (FBGA) package
- Four-input look-up tables (LUTs) for logic capacity
- 900 Maximum MHz performance
- 3.3V power supply
- Wide range of I/O standards supported
Application
- Telecommunications
- Networking
- Wireless communication
- Industrial automation
- Consumer electronics
- Medical devices
- Automotive
- Military and aerospace
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
| Series | XC3S2000 | Number of Logic Elements | 46080 LE |
| Adaptive Logic Modules - ALMs | 20480 ALM | Embedded Memory | 720 kbit |
| Number of I/Os | 333 I/O | Supply Voltage - Min | 1.14 V |
| Supply Voltage - Max | 1.26 V | Minimum Operating Temperature | 0 C |
| Maximum Operating Temperature | + 85 C | Mounting Style | SMD/SMT |
| Package / Case | FBGA-456 | Brand | AMD / Xilinx |
| Distributed RAM | 320 kbit | Embedded Block RAM - EBR | 720 kbit |
| Maximum Operating Frequency | 280 MHz | Moisture Sensitive | Yes |
| Number of Gates | 2000000 | Operating Supply Voltage | 1.2 V |
| Product Type | FPGA - Field Programmable Gate Array | Factory Pack Quantity | 1 |
| Subcategory | Programmable Logic ICs | Tradename | Spartan |
| Unit Weight | 1.380658 oz |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
-
![Product]( "Product")
Step1 :Product
-
![Vacuum packaging]( "Vacuum packaging")
Step2 :Vacuum packaging
-
![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
-
![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
-
![Packaging boxes]( "Packaging boxes")
Step5 :Packaging boxes
-
![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S2000-4FGG456C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S2000-4FTG256C
Brands :
Package :
Description :
Part Number : XC3S2000-4FG676C
Brands :
Package : BGA676
Description : 2000000 SYSTEM GATE 1.2 VOLT FPGA
Part Number : XC3S2000-4FG900C
Brands :
Package : 900-BBGA
Description : 2000000 SYSTEM GATE 1.2 VOLT FPGA
Part Number : XC3S2000-4FG456C
Brands :
Package : BGA-456
Description : 2000000 SYSTEM GATE 1.2 VOLT FPGA
Part Number : XC3S2000-5FGG456C
Brands :
Package : BGA456
Description : 2000000 SYSTEM GATE 1.2 VOLT FPGA
Part Number : XC3S2000-5FTG256C
Brands :
Package :
Description :
Part points
-
The XC3S2000-4FGG456C chip is a field-programmable gate array (FPGA) produced by Xilinx. It belongs to the Spartan-3 generation and has a capacity of 2 million system gates. The "4FGG456C" in the name refers to specific package and speed grade options. FPGAs are highly versatile integrated circuits that can be programmed and reprogrammed to perform various functions and tasks.
-
Equivalent
XC3S2000-4FGG456C is a specific variant of the Xilinx Spartan-3 FPGA family. Equivalent products would include other variants within the same family, such as XC3S2000-5FGG456C or XC3S2000-3FGG456C, which have slightly different speed grades but offer similar functionality and features. -
Features
The XC3S2000-4FGG456C is an FPGA (Field-Programmable Gate Array) device. It has 2 million system gates, 432 I/O Pins, a maximum of 332,544 Flip-Flops, and 3,456 Digital Signal Processing Slices. It operates at a maximum frequency of 400MHz and has a 4ns pin-to-pin routing delay. -
Pinout
The XC3S2000-4FGG456C is an FPGA from the Spartan-3 family. It has 456 pins and offers 2000 slices, 40 DSP blocks, and 244 I/Os. Its primary function is to implement digital logic circuits and algorithms, making it suitable for a wide range of applications including communication systems, automotive, and industrial control. -
Manufacturer
The manufacturer of the XC3S2000-4FGG456C is Xilinx Inc. It is an American technology company that specializes in the development and production of programmable logic devices, such as field-programmable gate arrays (FPGAs). Xilinx's products are used in a wide range of applications, including aerospace and defense, automotive, telecommunications, and data center industries. -
Application Field
The XC3S2000-4FGG456C is an FPGA (Field Programmable Gate Array) device that can be used in a wide range of applications such as telecommunications, industrial control systems, video processing, medical equipment, and automotive electronics. Its high logic capacity and performance make it suitable for complex digital designs requiring programmable logic. -
Package
The XC3S2000-4FGG456C chip has a package type of FGG456, a form of BGA (Ball Grid Array), and a size of 456 balls.
Datasheet PDF
We provide high quality products, thoughtful service and after sale guarantee
-
![Product]( "Product")
We have rich products, can meet your various needs.
-
![quantity]( "quantity")
Minimum order quantity starts from 1pcs.
-
![shipping]( "shipping")
Lowest international shipping fee starts from $0.00
-
![guarantee]( "guarantee")
365 days quality guarantee for all products
