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Xilinx XC3S1500-4FG676I 48HRS

FPGA Spartan-3 Family 1.5M Gates

ISO14001 ISO9001 DUNS

Brands: Amd

Mfr.Part #: XC3S1500-4FG676I

Datasheet: XC3S1500-4FG676I Datasheet (PDF)

Package/Case: FBGA-676

RoHS Status:

Stock Condition: 3,626 pcs, New Original

Product Type: FPGAs (Field Programmable Gate Array)

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $406.606 $406.606
200 $157.352 $31470.400
500 $151.823 $75911.500
1000 $149.090 $149090.000

In Stock: 3,626 PCS

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Quick Quote

Please submit RFQ for XC3S1500-4FG676I or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S1500-4FG676I General Description

The XC3S1500-4FG676I is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It is part of the Spartan-3 family of FPGAs and features a total of 1.5 million system gates, making it suitable for a wide range of applications requiring high logic density and performance.This particular model, the XC3S1500-4FG676I, is housed in a 676-pin Fine-Pitch Ball Grid Array (FG676) package, which provides a balance between pin count and package size. It operates at a maximum frequency of 300 MHz and offers 450 user I/O pins, making it suitable for interfacing with external peripherals and devices.The XC3S1500-4FG676I also features 32 multipliers for DSP applications, internal memory blocks, and various on-chip resources for implementing complex digital designs. It has integrated configurable Logic Blocks (CLBs) for implementing custom logic functions, as well as Block RAM for storing data and lookup tables for implementing combinatorial logic.

xc3s1500-4fg676i

Features

  • Maximum gates: 1,500,000
  • 4 FPGAs
  • 676-pin BGA package
  • Low-power consumption
  • High performance
  • Advanced system-level power management
  • Extensive I/O capabilities
  • Flexible design options
  • Supports a wide range of applications
  • Robust and reliable

Application

  • Telecommunications
  • Networking
  • Industrial control systems
  • Consumer electronics
  • Automotive
  • Medical devices
  • Aerospace and defense
  • Audio/video processing
  • Data processing and storage
  • Robotics and automation
Amd Inventory

Specifications

Parameter Value Parameter Value
Product Category FPGA - Field Programmable Gate Array Series XC3S1500
Number of Logic Elements 29952 LE Number of I/Os 487 I/O
Supply Voltage - Min 1.2 V Supply Voltage - Max 1.2 V
Minimum Operating Temperature - 40 C Maximum Operating Temperature + 100 C
Mounting Style SMD/SMT Package / Case FBGA-676
Brand AMD / Xilinx Distributed RAM 208 kbit
Embedded Block RAM - EBR 576 kbit Maximum Operating Frequency 280 MHz
Moisture Sensitive Yes Number of Gates 1500000
Operating Supply Voltage 1.2 V Product Type FPGA - Field Programmable Gate Array
Factory Pack Quantity 1 Subcategory Programmable Logic ICs
Tradename Spartan

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S1500-4FG676I component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S1500-4FGG676C

Brands :  

Package :   BGA676

Description :   FPGA Spartan®-3 Family 1.5M Gates 29952 Cells 630MHz 90nm Technology 1.2V

Part Number :   XC3S1500-4FGG676I

Brands :  

Package :   BGA-676

Description :   1500000 SYSTEM GATE 1.2 VOLT FPGA

Part Number :   XC3S1500-4FTG256C

Brands :  

Package :  

Description :  

Part Number :   XC3S1500-4FTG256I

Brands :  

Package :  

Description :  

Part Number :   XC3S1500-4FTG320C

Brands :  

Package :  

Description :  

Part Number :   XC3S1500-4FTG320I

Brands :  

Package :  

Description :  

Part points

  • The XC3S1500-4FG676I chip is a Field-Programmable Gate Array (FPGA) manufactured by Xilinx. It belongs to the Spartan-3 family of devices and has a capacity of 1.5 million system gates. The chip features 1,544 slices, 32 DSP48A slices, and 36Kbits of block RAM. It is commonly used for various applications, including digital signal processing, networking, and embedded system design.
  • Equivalent

    There are no direct equivalent products of the XC3S1500-4FG676I chip. It is a specific model from the Xilinx Spartan-3 FPGA family. However, there are other FPGA chips available in the Spartan-3 series with different specifications and capabilities which may be suitable alternatives.
  • Features

    The XC3S1500-4FG676I is a Field-Programmable Gate Array (FPGA) with 1,536 inputs/outputs (IOs) and 1,574 kilobits of random-access memory (RAM). It operates at a maximum frequency of 217.5 megahertz (MHz) and is housed in a 676-ball grid array (BGA) package.
  • Pinout

    The XC3S1500-4FG676I is a Field-Programmable Gate Array (FPGA). It has 676 pins and a 1500 logic cell count. It is designed for various applications that require high-speed programmable logic.
  • Manufacturer

    The manufacturer of the XC3S1500-4FG676I is Xilinx. Xilinx is a leading American technology company specializing in the development and production of programmable logic devices, including FPGAs (Field-Programmable Gate Arrays). FPGAs are integrated circuits that can be programmed and reconfigured after manufacturing, making them highly versatile for various applications such as telecommunications, automotive, aerospace, and more.
  • Application Field

    The XC3S1500-4FG676I is a field-programmable gate array (FPGA) that can be used in various application areas such as telecommunications, aerospace and defense, industrial automation, and consumer electronics. It offers high performance and flexibility, making it suitable for a wide range of applications where custom logic implementation is required.
  • Package

    The XC3S1500-4FG676I chip has a 676-pin fine-pitch ball grid array (FG676) package type. It has a form factor of 27x27 mm and a size of approximately 669 square mm.

Datasheet PDF

Preliminary Specification XC3S1500-4FG676I PDF Download

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