M41T62Q6F

Part points

• The M41T62Q6F is a real-time clock (RTC) chip from STMicroelectronics. It features a built-in temperature-compensated crystal oscillator (TCXO) for accurate timekeeping, a backup battery input for power-fail protection, and a serial I2C interface for communication. This chip is commonly used in applications requiring precise timekeeping and event scheduling.

• Equivalent

  The equivalent products of M41T62Q6F chip are DS3231, MCP7940N, RV-3032-C7, and PCF2127. These real-time clock (RTC) chips offer features similar to M41T62Q6F and can be used as drop-in replacements in many applications.

• Features

  The M41T62Q6F is a low-power RTC (Real Time Clock) with integrated crystal oscillator, providing timekeeping accuracy of ±1 ppm over a temperature range of -40°C to +85°C. It has a small form factor, low power consumption, and battery backup support, making it suitable for portable and energy-efficient applications.

• Pinout

  The M41T62Q6F is a serial real-time clock IC with a 16-pin SOIC package. It features a clock/calendar with years up to 2100, a 64-bit unique ID, and a programmable alarm with repeat modes. The device has power down and battery switch options for low power consumption.

• Manufacturer

  The M41T62Q6F is manufactured by STMicroelectronics, a multinational semiconductor manufacturer specializing in various components for electronics and technology applications. STMicroelectronics is known for producing a wide range of microcontrollers, sensors, power management ICs, and other electronic components for industries such as automotive, consumer electronics, and industrial equipment.

• Application Field

  The M41T62Q6F is commonly used as a real-time clock (RTC) in various applications including industrial automation, consumer electronics, and automotive systems. It provides accurate timekeeping, alarm functions, and a battery backup for maintaining time and date information during power outages.

• Package

  The M41T62Q6F chip is in a SOX8 package, which is a small outline IC package. It comes in a 150mil width, 3.0mm height, and is 0.65mm pitch. The chip itself is in a 8-lead SO package measuring 3.9mm x 8.7mm.