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K4B2G1646F-BCK0
DRAM Chip DDR3 SDRAM 2Gbit 128Mx16 1.5V 96-Pin FBGA
Brands: SAMSUNG
Mfr.Part #: K4B2G1646F-BCK0
Datasheet: K4B2G1646F-BCK0 Datasheet (PDF)
Package/Case: BGA-96
Product Type: Memory
K4B2G1646F-BCK0 General Description
K4B2G1646F-BCK0 is a specific type of electronic component, known as a Dynamic Random Access Memory (DRAM) module. Here are some details about it:
Features
- 1. Memory capacity: 2 Gigabits (Gb)
- 2. Organization: 256 Megabytes (MB) x 16 bits x 8 banks
- 3. Speed: 1600 Megahertz (MHz) with a data rate of 800 Megabits per second (Mbps) per pin
- 4. Operating voltage: 1.35 volts
Application
- 1. Personal computers (PCs), laptops, and servers: It is commonly used as the main memory in these devices to store and quickly access data during program execution.
- 2. Mobile devices: It can serve as the primary memory in smartphones, tablets, and other portable gadgets, allowing for efficient data processing and multitasking.
- 3. Consumer electronics: It is suitable for gaming consoles, set-top boxes, and digital TVs to enhance system performance and responsiveness.
- 4. Industrial applications: DRAM modules like K4B2G1646F-BCK0 are used in various industrial control systems, automated machinery, and robotics to support real-time data processing.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| EU RoHS | Compliant | ECCN (US) | EAR99 |
| Part Status | Obsolete | Automotive | No |
| PPAP | No | DRAM Type | DDR3 SDRAM |
| Chip Density (bit) | 2G | Organization | 128Mx16 |
| Number of Internal Banks | 8 | Number of Words per Bank | 16M |
| Number of Bits/Word (bit) | 16 | Data Bus Width (bit) | 16 |
| Maximum Clock Rate (MHz) | 1600 | Maximum Access Time (ns) | 0.225 |
| Address Bus Width (bit) | 17 | Interface Type | SSTL_1.5 |
| Minimum Operating Supply Voltage (V) | 1.425 | Maximum Operating Supply Voltage (V) | 1.575 |
| Operating Current (mA) | 118 | Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 95 | Number of I/O Lines (bit) | 16 |
| Mounting | Surface Mount | Package Width | 7.5 |
| Package Length | 13.3 | PCB changed | 96 |
| Standard Package Name | BGA | Supplier Package | FBGA |
| Pin Count | 96 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
-
The K4B2G1646F-BCK0 chip is a high-density DDR3 SDRAM chip commonly used in computer systems and electronic devices. It offers increased memory capacity and faster data transfer speeds compared to lower-density chips. This chip is popular for its reliability, performance, and compatibility with a wide range of applications.
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Equivalent
The equivalent products of K4B2G1646F-BCK0 chip are H5TC4G63CFR-PBA and MT41K256M16TW-107WT:B. These chips have similar specifications and functions, making them suitable replacements for the K4B2G1646F-BCK0 chip in various applications. -
Features
1. DDR4 SDRAM memory module 2. 2GB capacity 3. 8Gb density 4. 2Rx8 organization 5. 2133MT/s data transfer rate 6. 288-pin 7. PC4-17000 8. Low power consumption 9. RoHS compliant 10. High-quality and reliable performance -
Pinout
The K4B2G1646F-BCK0 is a 78-ball FBGA DDR3L SDRAM chip with a pin count of 78. It functions as a high-speed, low-power memory component for various electronic devices such as smartphones, tablets, and laptops. -
Manufacturer
Samsung is the manufacturer of the K4B2G1646F-BCK0. It is a South Korean multinational conglomerate company specializing in various industries such as electronics, semiconductors, and telecommunications. Samsung is one of the largest and most reputable companies in the world, known for its high-quality products and technological innovations. -
Application Field
The K4B2G1646F-BCK0 is typically used in applications such as mobile devices, computing systems, and networking equipment that require high-density and high-speed DDR3 SDRAM. It is commonly utilized in smartphones, tablets, gaming consoles, routers, and other consumer electronics. -
Package
The K4B2G1646F-BCK0 chip comes in a 78-ball FBGA (Fine-pitch Ball Grid Array) package, with a form factor of DDR4 SDRAM. The size of the chip is 8Gb (1Gx8) and it is capable of supporting speeds up to 2400 Mbps.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
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