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K4B1G1646G-BCH9
DDR DRAM, 64MX16, 0.255ns, CMOS, PBGA96
Brands: SAMSUNG
Mfr.Part #: K4B1G1646G-BCH9
Datasheet: K4B1G1646G-BCH9 Datasheet (PDF)
Package/Case: FBGA96
Product Type: Memory chips
Ovaga has a large stock of K4B1G1646G-BCH9 Memory chips from SAMSUNG and we guarantee that they are original,brand new parts sourced directly from SAMSUNG We can provide quality testing reports for K4B1G1646G-BCH9 upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| ECCN (US) | EAR99 | Part Status | Obsolete |
| Automotive | No | PPAP | No |
| DRAM Type | DDR3 SDRAM | Chip Density (bit) | 1G |
| Organization | 64Mx16 | Number of Internal Banks | 8 |
| Number of Words per Bank | 8M | Number of Bits/Word (bit) | 16 |
| Data Bus Width (bit) | 16 | Maximum Clock Rate (MHz) | 1333 |
| Maximum Access Time (ns) | 0.255 | Address Bus Width (bit) | 16 |
| Interface Type | SSTL_1.5 | Minimum Operating Supply Voltage (V) | 1.425 |
| Typical Operating Supply Voltage (V) | 1.5 | Maximum Operating Supply Voltage (V) | 1.575 |
| Operating Current (mA) | 120 | Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 95 | Number of I/O Lines (bit) | 16 |
| Mounting | Surface Mount | Package Height | 0.75 |
| Package Width | 7.5 | Package Length | 13.3 |
| PCB changed | 96 | Standard Package Name | BGA |
| Supplier Package | FBGA | Pin Count | 96 |
| Lead Shape | Ball |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The K4B1G1646G-BCH9 chip is a 1 Gb DDR3 SDRAM component manufactured by Samsung. It is commonly used in various electronic devices such as computers, laptops, and servers to provide high-speed memory access for improved performance and efficiency.
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Equivalent
The equivalent products of the K4B1G1646G-BCH9 chip are MT41K1G8SN-125 and NT5CC256M16CP-DI. -
Features
K4B1G1646G-BCH9 is a DDR4 SDRAM with a capacity of 1 Gb and a speed of 2133 MHz. It operates at a low voltage of 1.2V, making it energy-efficient. This memory module is designed for use in computing devices requiring reliable and high-speed performance. -
Pinout
The K4B1G1646G-BCH9 is a 78-ball FBGA DRAM chip with a 11.5mm x 13mm package size. It has a 16-bit I/O interface and operates at 1.7V to 1.95V. The pin count includes VDD, VSS, DQ, DM, CLK, CKE, CS, and more for various functions such as power, data input/output, and control signals. -
Manufacturer
Samsung is the manufacturer of the K4B1G1646G-BCH9. It is a South Korean multinational conglomerate specializing in consumer electronics, semiconductors, and telecommunications equipment. Samsung is well-known for producing a wide range of electronic devices such as smartphones, televisions, and memory chips. -
Application Field
The K4B1G1646G-BCH9 is commonly used in electronics such as smartphones, tablets, laptops, and gaming consoles. It is also suitable for applications in automotive electronics, industrial control systems, and network devices. The high-speed performance and low power consumption make it an ideal choice for various memory-intensive applications. -
Package
The K4B1G1646G-BCH9 chip is a 78-ball FBGA package type, with a form factor of 10.8mm x 13.6mm x 1.2mm. It is a 1Gb DDR3 SDRAM chip with a size of 128 Meg x 8.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
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