Altera EPM570F256C5N

Part points

• EPM570F256C5N is a field-programmable gate array (FPGA) chip developed by Intel. It belongs to the MAX II family and offers 256 kilobits of embedded memory. This chip provides versatile programmable logic and is commonly used in various applications including telecommunications, industrial automation, and consumer electronics. With its compact size and enhanced features, EPM570F256C5N offers flexibility and customization options for designing electronic systems.

• Equivalent

  There are no direct equivalent products for the EPM570F256C5N chip. However, similar devices in the Altera Cyclone EP1C3 family may meet the requirements, such as the EP1C3F256C8N or EP1C3F256C6N. It is recommended to consult the product datasheets or contact the manufacturer for specific alternatives.

• Features

  The EPM570F256C5N is a field programmable gate array (FPGA) with 256,000 logic elements, 3.3V operating voltage, 570 I/O pins, and 5ns maximum operating frequency. It features 1,152KB embedded RAM, support for configurable I/O standards, and advanced configuration options. It is suitable for a variety of applications requiring high-performance programmable logic.

• Pinout

  The EPM570F256C5N has a pin count of 256. It is a Cyclone II FPGA device from Intel (formerly Altera) and supports various functions such as logic, memory, and arithmetic operations. The specific pin functions will depend on the circuit design and configuration.

• Manufacturer

  The manufacturer of the EPM570F256C5N is Altera Corporation. Altera Corporation is a semiconductor company that primarily designs and manufactures programmable logic devices (PLDs), also known as field-programmable gate arrays (FPGAs). They offer a range of products and solutions for various industries, including communications, automotive, and industrial applications.

• Application Field

  The EPM570F256C5N is an FPGA (Field-Programmable Gate Array) device, commonly used in various application areas including telecommunications, industrial automation, automotive electronics, medical devices, and defense systems. Its versatility, reprogrammable nature, and high-performance capabilities make it suitable for a wide range of applications.

• Package

  The EPM570F256C5N chip has a BGA (Ball Grid Array) package type, is available in a 256-ball package form, and has a size of approximately 17mm x 17mm.