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Altera EP4SGX360KF40I3N

FPGA Stratix® IV GX Family 353600 Cells 40nm Technology 0.9V 1517-Pin FC-FBGA

ISO14001 ISO9001 DUNS

Brands: Altera Corporation (Intel)

Mfr.Part #: EP4SGX360KF40I3N

Datasheet: EP4SGX360KF40I3N Datasheet (PDF)

Package/Case: FBGA-1517

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3316 pcs, New Original

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EP4SGX360KF40I3N General Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 23105536 353600 1517-BBGA, FCBGA

ep4sgx360kf40i3n

Features

  • The EP4SGX360KF40I3N is a member of the Stratix IV family of FPGAs.
  • It has 360K logic elements (LEs) and 11.3 Mb of embedded memory.
  • It has a maximum core clock frequency of 840 MHz and supports up to 1.6 Gbps transceivers.
  • It also includes hard IP blocks such as PCI Express Gen2, DDR3, and Ethernet MAC.
Altera Corporation (Intel) Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Stratix® IV GX feature-process-technology 40nm
feature-maximum-number-of-user-i-os 736 feature-number-of-registers 282880
feature-device-logic-cells 353600 feature-device-system-gates
feature-number-of-multipliers 1040 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 22564 feature-total-number-of-block-ram 48+1248
feature-ethernet-macs 1 feature-supported-ip-core SD/MMC SPI|UART|V-by-One HS|Viterbi Compiler, Low-Speed/Hybrid Serial Decoder
feature-supported-ip-core-manufacture Altera/CAST, Inc/Bitec/Eureka Technology Inc/El Camino GmbH feature-maximum-number-of-serdes-channels 88
feature-device-logic-units 353600 feature-device-number-of-dlls-plls 8
feature-transceiver-blocks 36 feature-transceiver-speed-gbps 8.5
feature-dedicated-dsp 130 feature-pci-blocks 2
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 3 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported LVDS|LVPECL feature-single-ended-i-o-standards-supported HSTL|SSTL|PCI-X|PCI|CMOS|LVTTL
feature-external-memory-interface QDRII+SRAM|RLDRAM II|DDR3 SDRAM|DDR2 SDRAM feature-minimum-operating-supply-voltage-v 0.87
feature-maximum-operating-supply-voltage-v 0.93 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 1517 feature-supplier-package FC-FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A001.a.7.a
feature-svhc Yes

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4SGX360KF40I3N chip is a high-performance field-programmable gate array (FPGA) manufactured by Intel. It is part of the Stratix IV GX series and offers 360,000 logic elements along with other integrated features like embedded memory, high-speed transceivers, and advanced digital signal processing capabilities. This chip is commonly used in applications such as telecommunications, networking, and high-performance computing due to its versatility and powerful performance.
  • Features

    The EP4SGX360KF40I3N is a 40 nm FPGA with 360K Logic Elements, 12Gb DDR3 SDRAM support, and 5.3Gbps transceivers. It includes embedded transceivers, high-speed differential I/O standards, and enhanced DSP blocks for high-performance computing applications.
  • Pinout

    The EP4SGX360KF40I3N is a Field-Programmable Gate Array (FPGA) chip manufactured by Intel. It has a pin count of 1517 pins and is used for high-performance applications. The specific function of each pin may vary depending on the application and configuration of the FPGA.
  • Manufacturer

    The manufacturer of the EP4SGX360KF40I3N is Intel Corporation. It is an American multinational technology company known for designing and manufacturing a wide range of computer processors, software, and other related products.
  • Application Field

    The EP4SGX360KF40I3N is a field-programmable gate array (FPGA) used in various high-performance applications. Its application areas include telecommunications infrastructure, data centers, aerospace and defense systems, video processing and broadcasting, medical imaging and diagnostics, and high-performance computing.
  • Package

    The EP4SGX360KF40I3N chip is a field-programmable gate array (FPGA) manufactured by Intel (formerly Altera). Its package type is a flip-chip BGA (Ball Grid Array) with a 1517-ball count. The chip has a form factor of 40.4 x 40.4 mm, making it a compact and powerful solution for various high-performance applications.

Datasheet PDF

Preliminary Specification EP4SGX360KF40I3N PDF Download

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