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Altera EP4SE230F29I4N
FPGA Stratix® IV E Family 228000 Cells 40nm Technology 0.9V 780-Pin FC-FBGA
Brands: Altera Corporation (Intel)
Mfr.Part #: EP4SE230F29I4N
Datasheet: EP4SE230F29I4N Datasheet (PDF)
Package/Case: FBGA-780
Product Type: Programmable Logic ICs
EP4SE230F29I4N General Description
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 488 17544192 228000 780-BBGA, FCBGA
Features
- 230,000 logic elements (LEs)
- 1,288 embedded memory blocks (MBs)
- 28 high-speed transceiver channels
- Support for various high-speed serial protocols (e.g., PCIe, Serial RapidIO, XAUI, etc.)
- Built-in digital signal processing (DSP) blocks and hard IP (Intellectual Property) cores for common functions like memory controllers, Ethernet MACs, and PCI Express interfaces
- Low power consumption (depending on the configuration and operating conditions)
Application
- High-performance computing (HPC) and data center acceleration
- Communication and networking equipment (e.g., routers, switches, and wireless base stations)
- Industrial automation and control systems
- Test and measurement instruments
- Military and aerospace systems
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| feature-family-name | Stratix® IV E | feature-process-technology | 40nm |
| feature-maximum-number-of-user-i-os | 488 | feature-number-of-registers | 182400 |
| feature-device-logic-cells | 228000 | feature-device-system-gates | |
| feature-number-of-multipliers | 1288 (18x18) | feature-program-memory-type | SRAM |
| feature-ram-bits-kbit | 17133 | feature-total-number-of-block-ram | 22+1235 |
| feature-ethernet-macs | 1 | feature-supported-ip-core | Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V-by-One HS|UART|SD/MMC SPI |
| feature-supported-ip-core-manufacture | Altera/CAST, Inc/Bitec/Eureka Technology Inc/El Camino GmbH | feature-maximum-number-of-serdes-channels | 56 |
| feature-device-logic-units | 228000 | feature-device-number-of-dlls-plls | 4 |
| feature-transceiver-blocks | 16 | feature-transceiver-speed-gbps | 11.3 |
| feature-dedicated-dsp | 161 | feature-pci-blocks | |
| feature-programmability | Yes | feature-maximum-internal-frequency-mhz | |
| feature-speed-grade | 4 | feature-giga-multiply-accumulates-per-second | |
| feature-differential-i-o-standards-supported | LVPECL|LVDS | feature-single-ended-i-o-standards-supported | LVTTL|CMOS|PCI|PCI-X|SSTL|HSTL |
| feature-external-memory-interface | DDR2 SDRAM|DDR3 SDRAM|RLDRAM II|QDRII+SRAM | feature-minimum-operating-supply-voltage-v | 0.87 |
| feature-maximum-operating-supply-voltage-v | 0.93 | feature-packaging | |
| feature-rohs | feature-rad-hard | ||
| feature-pin-count | 780 | feature-supplier-package | FC-FBGA |
| feature-standard-package-name1 | BGA | feature-cecc-qualified | No |
| feature-esd-protection | feature-escc-qualified | ||
| feature-military | No | feature-aec-qualified | No |
| feature-aec-qualified-number | feature-auto-motive | No | |
| feature-p-pap | No | feature-eccn-code | 3A991 |
| feature-svhc | Yes |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The EP4SE230F29I4N chip is a field-programmable gate array (FPGA) from Altera. It is part of the Stratix IV series and offers high-performance processing capabilities for various applications. With its advanced features and programmable logic, it provides flexible and customizable solutions for industries such as telecommunications, aerospace, and defense.
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Features
EP4SE230F29I4N is a Field-Programmable Gate Array (FPGA) chip manufactured by Intel. It features 230,000 logic elements, a 29nm manufacturing process, and support for industrial-grade temperature range (-40ºC to 100ºC). It includes advanced embedded memory and high-speed transceivers, making it suitable for a wide range of applications such as industrial automation, communication, and automotive systems. -
Pinout
The EP4SE230F29I4N FPGA has 1492 pin count and its functions include programmable logic cells, embedded memory blocks, high-speed transceivers, and DSP blocks for advanced digital signal processing applications. -
Manufacturer
EP4SE230F29I4N is a field-programmable gate array (FPGA) manufactured by Intel Corporation. Intel is an American multinational corporation known for designing and manufacturing semiconductor chips and other related technology products. It is one of the leading manufacturers in the global semiconductor industry and supplies a wide range of products for various applications including computing, networking, and other electronic devices. -
Application Field
The EP4SE230F29I4N is a programmable logic device (PLD) and can be used in various application fields, including industrial automation, telecommunications, aerospace, defense, and medical equipment. It is specifically designed for high-performance applications that require complex digital signal processing, data processing, and control functions. -
Package
The EP4SE230F29I4N chip has a ball grid array (BGA) package type, with form factor size of 29 mm x 29 mm.
Datasheet PDF
Key points
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The EP4SE230F29I4N chip is a field-programmable gate array (FPGA) from Altera. It is part of the Stratix IV series and offers high-performance processing capabilities for various applications. With its advanced features and programmable logic, it provides flexible and customizable solutions for industries such as telecommunications, aerospace, and defense.
-
Features
EP4SE230F29I4N is a Field-Programmable Gate Array (FPGA) chip manufactured by Intel. It features 230,000 logic elements, a 29nm manufacturing process, and support for industrial-grade temperature range (-40ºC to 100ºC). It includes advanced embedded memory and high-speed transceivers, making it suitable for a wide range of applications such as industrial automation, communication, and automotive systems. -
Pinout
The EP4SE230F29I4N FPGA has 1492 pin count and its functions include programmable logic cells, embedded memory blocks, high-speed transceivers, and DSP blocks for advanced digital signal processing applications. -
Manufacturer
EP4SE230F29I4N is a field-programmable gate array (FPGA) manufactured by Intel Corporation. Intel is an American multinational corporation known for designing and manufacturing semiconductor chips and other related technology products. It is one of the leading manufacturers in the global semiconductor industry and supplies a wide range of products for various applications including computing, networking, and other electronic devices. -
Application Field
The EP4SE230F29I4N is a programmable logic device (PLD) and can be used in various application fields, including industrial automation, telecommunications, aerospace, defense, and medical equipment. It is specifically designed for high-performance applications that require complex digital signal processing, data processing, and control functions. -
Package
The EP4SE230F29I4N chip has a ball grid array (BGA) package type, with form factor size of 29 mm x 29 mm.
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