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Altera EP4CGX75DF27I7N

FPGA Cyclone® IV GX Family 73920 Cells 60nm Technology 1.2V 672-Pin FBGA

ISO14001 ISO9001 DUNS

Brands: Altera Corporation (Intel)

Mfr.Part #: EP4CGX75DF27I7N

Datasheet: EP4CGX75DF27I7N Datasheet (PDF)

Package/Case: FBGA-672

RoHS Status:

Stock Condition: 2294 pcs, New Original

Product Type: Programmable Logic ICs

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $192.481 $192.481
30 $185.152 $5554.560

In Stock:2294 PCS

- +

Quick Quote

Please submit RFQ for EP4CGX75DF27I7N or email to us: Email: [email protected], we will contact you within 12 hours.

EP4CGX75DF27I7N General Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 310 4257792 73920 672-BGA

Altera Corporation (Intel) Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® IV GX feature-process-technology 60nm
feature-maximum-number-of-user-i-os 310 feature-number-of-registers
feature-device-logic-cells 73920 feature-device-system-gates
feature-number-of-multipliers 198 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 4158 feature-total-number-of-block-ram 462
feature-ethernet-macs feature-supported-ip-core Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Sub-frame Latency JPEG 2000 Encoder (BA130)|PCI Express to AXI Bridge Controller (GPEX-PAB)|ISA/PC Card/PCMCIA/Compact Flash Host Adapter
feature-supported-ip-core-manufacture Altera/CAST, Inc/Barco Silex/Mobiveil, Inc/Eureka Technology Inc feature-maximum-number-of-serdes-channels
feature-device-logic-units 73920 feature-device-number-of-dlls-plls 4
feature-transceiver-blocks 8 feature-transceiver-speed-gbps 3.125
feature-dedicated-dsp feature-pci-blocks 1
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 7 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL feature-single-ended-i-o-standards-supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
feature-external-memory-interface DDR2 SDRAM|QDRII+SRAM feature-minimum-operating-supply-voltage-v 1.16
feature-maximum-operating-supply-voltage-v 1.24 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 672 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991
feature-svhc No

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4CGX75DF27I7N chip is a Field Programmable Gate Array (FPGA) from Intel's Cyclone IV series. It features 75,000 logic elements, 476 dedicated user I/Os, and 352 Kbits of embedded memory. This chip is commonly used in a variety of applications, including telecommunications, automotive, and industrial control systems.
  • Equivalent

    Some equivalent products of EP4CGX75DF27I7N chip are EP4CGX75DF27C7, EP4CGX75DF27I7, EP4CGX75DF27I7N, EP4CGX75DF27I7N, and EP4CGX75DF27I7N. These products are all part of the Cyclone IV GX FPGA family and offer similar performance and features.
  • Features

    EP4CGX75DF27I7N is a programmable logic device from Intel with a total of 7,520 logic elements, 49,664 logic array blocks, and 504 I/O pins. It has a maximum of 303 user I/Os, 6 analog blocks, and 1.7 Mbits of RAM capacity. It is ideal for applications that require high performance and flexibility.
  • Pinout

    The EP4CGX75DF27I7N is a 780-pin FPGA with a quad-flat package. It features 75,000 logic elements and 1,140 Kbits of RAM. Its main functions include logic implementation, signal processing, and digital communication.
  • Manufacturer

    The EP4CGX75DF27I7N is manufactured by Intel Corporation. Intel is a multinational technology company that specializes in the design and manufacturing of semiconductor chips and other computer-related technologies. They are a leading provider of processors for a wide range of devices, including computers, smartphones, and servers.
  • Application Field

    The EP4CGX75DF27I7N is a field-programmable gate array (FPGA) commonly used in industrial automation, communication systems, automotive applications, and medical devices. It can be used in a wide range of applications that require high-speed processing, flexible connectivity, and programmable logic capabilities.
  • Package

    The EP4CGX75DF27I7N chip is a FPGA (Field Programmable Gate Array) in a FBGA (Fine-Pitch Ball Grid Array) package. It has a form factor of 27x27 mm and a size of 676 ball grid array.

Datasheet PDF

Preliminary Specification EP4CGX75DF27I7N PDF Download

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