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NXP MC56F8323VFBE

Packaged in trays for convenient handling and storage

ISO14001 ISO9001 DUNS

Brands: NXP

Mfr.Part #: MC56F8323VFBE

Datasheet: MC56F8323VFBE Datasheet (PDF)

Package/Case: LQFP-64

Product Type: Embedded Processors & Controllers

RoHS Status:

Stock Condition: 2075 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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MC56F8323VFBE General Description

The MC56F8323VFBE is a digital signal controller (DSC) from NXP Semiconductors. It belongs to the MC56F83xx family of DSCs and is based on a 32-bit core operating at up to 60 MHz. This controller is designed for applications that require real-time control and high-performance signal processing. Some key features of the MC56F8323VFBE include 64 KB of Flash memory, 8 KB of SRAM, and various peripherals such as PWM modules, analog-to-digital converters, and communication interfaces like SPI and I2C. This DSC also has built-in safety and security features, making it suitable for use in industrial and automotive applications.The MC56F8323VFBE comes in a 48-pin LQFP package and operates over a wide temperature range, making it suitable for use in harsh environments.

mc56f8323vfbe

Features

  • Dual core 16-bit digital signal controller
  • Up to 60 MHz CPU clock
  • 68 KB flash memory, 8 KB data flash memory
  • 8 KB SRAM
  • 12-bit ADC
  • 16-bit PWM
  • CAN controller
  • SPI, I2C, UART interfaces
  • Various timers and communication peripherals
  • Operating voltage: 3.0V to 3.6V
  • Application

  • The MC56F8323VFBE is a digital signal controller commonly used in industrial automation, motor control, power management, and consumer electronics applications
  • It is suitable for tasks requiring real-time control, signal processing, and connectivity capabilities, making it a versatile choice for a variety of embedded systems projects
  • Specifications

    Parameter Value Parameter Value
    orderingCode 935309359557 isDistributor true
    isReqSample true salesNum MC56F8323VFBE
    leadTime 26 requaestItemType REQUEST_SAMPLE
    pack_type TRAY price_flg N
    pack_desc Tray, Bakeable, Multiple in Drypack minPackQty 160
    status Not Recommended for New Designs

    Shipping

    Shipping Type Ship Fee Lead Time
    DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
    Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
    UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
    TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
    EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
    REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

    Processing Time:Shipping fee depend on different zone and country.

    Payment

    Terms of payment Hand Fee
    Wire Transfer Wire Transfer charge US$30.00 banking fee.
    Paypal Paypal charge 4.0% service fee.
    Credit Card Credit Card charge 3.5% service fee.
    Western Union Western Union charge US.00 banking fee.
    Money Gram Money Gram charge US$0.00 banking fee.

    Guarantees

    1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

    2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

    Packing

    • Product

      Step1 :Product

    • Vacuum packaging

      Step2 :Vacuum packaging

    • Anti-static bag

      Step3 :Anti-static bag

    • Individual packaging

      Step4 :Individual packaging

    • Packaging boxes

      Step5 :Packaging boxes

    • bar-code shipping tag

      Step6 :bar-code shipping tag

    All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

    Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

    We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

    After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

    • ESD
    • ESD

    Part points

    • The MC56F8323VFBE chip is a microcontroller from NXP Semiconductors. It is based on the 56800E core and belongs to the 32-bit MCU series. It offers 100 MHz maximum frequency, 512 KB of flash memory, 52 KB of RAM, and various communication interfaces. This chip is commonly used in industrial control applications, motor control systems, and other embedded systems requiring high-performance processing capabilities.
    • Equivalent

      There are no direct equivalent products to the MC56F8323VFBE chip. However, some alternative microcontrollers that could be considered are the MC56F8006, MC56F8002, and MC56F8006VLH. These chips have similar features and capabilities but may not be an exact match for the MC56F8323VFBE.
    • Features

      MC56F8323VFBE is a microcontroller with the following features: 32-bit core, 40 MHz bus frequency, 32 KB flash memory, 6 KB RAM, enhanced peripheral integration with multiple timers, CAN and LIN support, ADC and DAC converters, UART, I2C, SPI interfaces, and low-power capabilities for battery-operated applications.
    • Pinout

      The MC56F8323VFBE is a microcontroller with 64 pins. It is part of the MC56F83xx series from NXP.
    • Manufacturer

      The MC56F8323VFBE is manufactured by NXP Semiconductors. It is a global semiconductor company that specializes in the development and production of high-performance integrated circuits and systems for a wide range of applications across various industries including automotive, industrial, consumer electronics, and more.
    • Application Field

      The MC56F8323VFBE is a microcontroller designed for motor control applications. It is suitable for a wide range of applications including home appliances, industrial automation, consumer electronics, and automotive systems. With its advanced processing capabilities and integrated peripherals, it provides efficient and reliable motor control solutions.
    • Package

      The MC56F8323VFBE chip is available in a 64-LQFP (Low Profile Quad Flat Package) package. The form of the chip is LQFP, and its size is 10mm x 10mm.

    Datasheet PDF

    Preliminary Specification MC56F8323VFBE PDF Download

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