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EP4CE55F23I7N
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 324 2396160 55856 484-BGA
Brands: Intel / Altera
Mfr.Part #: EP4CE55F23I7N
Datasheet: EP4CE55F23I7N Datasheet (PDF)
Package/Case: FBGA-484
Product Type: FPGA - Field Programmable Gate Array
RoHS Status:
Stock Condition: 9829 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Cyclone® IV E Field Programmable Gate Array (FPGA) IC 324 2396160 55856 484-BGA
Features
- Low-cost, low-power FPGA fabric:
- 6K to 150K logic elements
- Up to 6.3 Mb of embedded memory
- Up to 360 18 × 18 multipliers for DSP processing intensive applications
- Protocol bridging applications for under 1.5 W total power
- Cyclone IV GX devices offer up to eight high-speed transceivers that provide:
- Data rates up to 3.125 Gbps
- 8B/10B encoder/decoder
- 8-bit or 10-bit physical media attachment (PMA) to physical coding sublayer (PCS) interface
- Byte serializer/deserializer (SERDES)
- Word aligner
- Rate matching FIFO
- TX bit slipper for Common Public Radio Interface (CPRI)
- Electrical idle
- Dynamic channel reconfiguration allowing you to change data rates andprotocols on-the-fly
- Static equalization and pre-emphasis for superior signal integrity
- 150 mW per channel power consumption
- Flexible clocking structure to support multiple protocols in a single transceiver block
- Cyclone IV GX devices offer dedicated hard IP for PCI Express (PIPE) (PCIe) Gen 1:
- ×1, ×2, and ×4 lane configurations
- End-point and root-port configurations
- Up to 256-byte payload
- One virtual channel
- 2 KB retry buffer
- 4 KB receiver (Rx) buffer
- Cyclone IV GX devices offer a wide range of protocol support:
- PCIe (PIPE) Gen 1 ×1, ×2, and ×4 (2.5 Gbps)
- Gigabit Ethernet (1.25 Gbps)
- CPRI (up to 3.072 Gbps)
- XAUI (3.125 Gbps)
- Triple rate serial digital interface (SDI) (up to 2.97 Gbps)
- Serial RapidIO (3.125 Gbps)
- Basic mode (up to 3.125 Gbps)
- V-by-One (up to 3.0 Gbps)
- DisplayPort (2.7 Gbps)
- Serial Advanced Technology Attachment (SATA) (up to 3.0 Gbps)
- OBSAI (up to 3.072 Gbps)
- Up to 532 user I/Os
- LVDS interfaces up to 840 Mbps transmitter (Tx), 875 Mbps Rx
- Support for DDR2 SDRAM interfaces up to 200 MHz
- Support for QDRII SRAM and DDR SDRAM up to 167 MHz
- Up to eight phase-locked loops (PLLs) per device
- Offered in commercial and industrial temperature grades
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Status | Active | Programmabe | Not Verified |
| Number of LABs/CLBs | 3491 | Number of Logic Elements/Cells | 55856 |
| Total RAM Bits | 2396160 | Number of I/O | 324 |
| Number of Gates | - | Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 484-BGA |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The EP4CE55F23I7N is a field-programmable gate array (FPGA) chip produced by Intel. It features 55,000 logic elements, 1,518 Kbits of embedded memory, and 396 18 x 18 multipliers. This chip is commonly used in a variety of applications such as telecommunications, automotive, and industrial automation.
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Equivalent
The equivalent products of EP4CE55F23I7N chip are Altera Altera Cyclone IV EP4CE55F23A7N, Altera Altera Cyclone IV EP4CE55F23I7, Altera Cyclone IV EP4CE55F23C6. These chips have similar specifications in terms of logic elements, memory blocks, and performance capabilities. -
Features
The EP4CE55F23I7N is a Field Programmable Gate Array (FPGA) by Altera (now Intel) with 55,000 logic elements, 3,888 Kbits RAM, 475 multipliers, and 480 I/O pins. It supports 140 user I/O pins and is compatible with both VHDL and Verilog programming languages. -
Pinout
The EP4CE55F23I7N is a 324-pin FPGA (Field-Programmable Gate Array) with 53,760 logic elements, 1,974 Kbits of RAM, and 360 18x18 multipliers. It also features differential I/O standards, gigabit transceivers, and support for various communication protocols such as PCI Express and Ethernet. -
Manufacturer
The EP4CE55F23I7N is manufactured by Intel, which is a multinational technology company specializing in semiconductor manufacturing and computing innovation. Intel is known for producing a wide range of processors, memory chips, and other hardware products that power a variety of devices such as computers, smartphones, and servers. -
Application Field
The EP4CE55F23I7N is commonly used in applications requiring high-performance programmable logic devices, such as telecommunications, data communication, and industrial automation. It is also well-suited for aerospace and defense, automotive, and consumer electronics. This versatile FPGA offers high logic density, high-speed interfaces, and abundant I/O options for demanding design requirements. -
Package
The EP4CE55F23I7N chip is available in a BGA package with a size of 672-ball grid array. The form factor is surface mount and the dimensions are 23mm x 23mm.
We provide high quality products, thoughtful service and after sale guarantee
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