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Altera EP3C10E144I7
FPGA Cyclone® III Family 10320 Cells 437.5MHz 65nm Technology 1.2V 144-Pin EQFP EP
Brands: Altera Corporation (Intel)
Mfr.Part #: EP3C10E144I7
Datasheet: EP3C10E144I7 Datasheet (PDF)
Package/Case: QFP144
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2309 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomEP3C10E144I7 General Description
Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 10320 144-LQFP Exposed Pad
Features
- "EP3C" refers to the Cyclone III series of FPGAs, which are programmable logic devices designed for digital logic applications.
- "10" refers to the specific family member within the Cyclone III series, with different numbers indicating different levels of capacity and performance.
- "E144" refers to the package type and pin count. "E144" indicates a 144-pin FineLine BGA (Ball Grid Array) package, which is a type of integrated circuit package with solder balls on the bottom for surface mounting onto a printed circuit board.
- "I7" refers to the speed grade or performance rating of the FPGA. "I7" indicates a commercial-grade (0 to 85 degrees Celsius) device.
Application
- Logic capacity: It has a capacity of up to 10,000 logic elements (LEs), which are the basic building blocks of programmable logic.
- Embedded memory: It may include up to 414 kilobits (Kb) of embedded memory for storing data within the FPGA.
- Digital signal processing (DSP) blocks: It may include up to 54 embedded DSP blocks for implementing high-performance digital signal processing functions.
- I/O interfaces: It may have various I/O interfaces such as GPIO (General Purpose Input/Output) pins, LVDS (Low Voltage Differential Signaling) channels, and other interfaces for communication with external devices.
- Clocking resources: It may include phase-locked loops (PLLs) and clock multiplexers for generating and distributing clock signals within the FPGA.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| feature-family-name | Cyclone® III | feature-process-technology | 65nm |
| feature-maximum-number-of-user-i-os | 94 | feature-number-of-registers | |
| feature-device-logic-cells | 10320 | feature-device-system-gates | |
| feature-number-of-multipliers | 23 (18x18) | feature-program-memory-type | SRAM |
| feature-ram-bits-kbit | 414 | feature-total-number-of-block-ram | 46 |
| feature-ethernet-macs | feature-supported-ip-core | Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V1 ColdFire|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|10 Gigabit Ethernet MAC|32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz | |
| feature-supported-ip-core-manufacture | Altera/Freescale/CAST, Inc/MorethanIP/PLDA | feature-maximum-number-of-serdes-channels | |
| feature-device-logic-units | 10320 | feature-device-number-of-dlls-plls | 2 |
| feature-transceiver-blocks | feature-transceiver-speed-gbps | ||
| feature-dedicated-dsp | feature-pci-blocks | ||
| feature-programmability | No | feature-maximum-internal-frequency-mhz | 437.5 |
| feature-speed-grade | 7 | feature-giga-multiply-accumulates-per-second | |
| feature-differential-i-o-standards-supported | LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS | feature-single-ended-i-o-standards-supported | LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL |
| feature-external-memory-interface | DDR2 SDRAM|QDRII+SRAM | feature-minimum-operating-supply-voltage-v | 1.15 |
| feature-maximum-operating-supply-voltage-v | 1.25 | feature-packaging | |
| feature-rohs | feature-rad-hard | ||
| feature-pin-count | 144 | feature-supplier-package | EQFP EP |
| feature-standard-package-name1 | QFP | feature-cecc-qualified | No |
| feature-esd-protection | feature-escc-qualified | ||
| feature-military | No | feature-aec-qualified | No |
| feature-aec-qualified-number | feature-auto-motive | No | |
| feature-p-pap | No | feature-eccn-code | EAR99 |
| feature-svhc | Yes |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the EP3C10E144I7 component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : Embedded
Brands :
Package :
Description : systems: It can be used to implement digital logic functions in embedded systems such as industrial automation, robotics, and automotive electronics.
Part Number : Communication
Brands :
Package :
Description : systems: It can be used for implementing digital signal processing and communication functions in wireless communication systems, networking equipment, and telecommunications.
Part Number : Test
Brands :
Package :
Description : and measurement: It can be used in test and measurement equipment for implementing digital logic functions and signal processing algorithms for data analysis and measurement.
Part Number : Prototyping
Brands :
Package :
Description : and validation: It can be used as a prototyping platform for validating and verifying digital logic designs before implementing them in application-specific integrated circuits (ASICs) or other custom hardware.
Part points
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The EP3C10E144I7 chip is a member of altera's cyclone iii fpga family. it offers 10,570 logic elements, 308 kilobits of embedded memory, and five phase-locked loops. with integrated high-speed transceivers and low-power consumption, this chip is suitable for a range of applications like digital signal processing, communications, and industrial automation. it supports various i/o standards and provides flexible configuration options, making it a versatile solution for hardware designers.
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Features
The features of EP3C10E144I7 include a total of 10,320 logic elements, a maximum of 144 user i/o pins, up to 372 kbits of embedded memory, and support for high-speed transceivers. it also offers enhanced low-power capabilities, advanced dsp blocks, high-speed routing, and a flexible i/o structure, making it suitable for a wide range of applications. -
Pinout
The EP3C10E144I7 is a 144-pin fpga (field-programmable gate array) from the cyclone iii family by intel (formerly altera). it has 144 pins and can be used for various functions, such as digital logic control, signal processing, and data management. -
Manufacturer
The manufacturer of the EP3C10E144I7 is altera corporation, which is a semiconductor company specializing in programmable logic devices. -
Application Field
The EP3C10E144I7 is a programmable logic device, so its application areas vary. it can be used in a wide range of industries, including telecommunications, automotive, medical, aerospace, and consumer electronics. it can be used for applications such as signal processing, control systems, image processing, and data storage, among others. -
Package
The EP3C10E144I7 chip is available in a bga package type, with a form factor of 144 pins. the size of the chip is 17x17 mm.
Datasheet PDF
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