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$5000Xilinx XCZU19EG-2FFVC1760I
SoC FPGA XCZU19EG-2FFVC1760I
Brands: AMD Xilinx, Inc
Mfr.Part #: XCZU19EG-2FFVC1760I
Datasheet: XCZU19EG-2FFVC1760I Datasheet (PDF)
Package/Case: FBGA-1760
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3,168 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XCZU19EG-2FFVC1760I General Description
SoC FPGA XCZU19EG-2FFVC1760ISoC FPGA XCZU19EG-2FFVC1760I
Features
L1 Cache Data Memory: 2 x 32 kB, 4 x 32 kB
Number of Logic Array Blocks - LABs: 65340 LAB
Operating Supply Voltage: 850 mV
Number of Cores: 7 Core
Core: ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2
Embedded Memory: 34.6 Mbit
Minimum Operating Temperature: -40°C
Maximum Clock Frequency: 600 MHz, 667 MHz, 1.5 GHz
Maximum Operating Temperature: +100°C
Package / Case: FBGA-1760
Number of Transceivers: 72 Transceiver
Product Category: SoC FPGA
Adaptive Logic Modules - ALMs: 65340 ALM
Number of Logic Elements: 1143450 LE
L1 Cache Instruction Memory: 2 x 32 kB, 4 x 32 kB
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Manufacturer: Xilinx
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Product Name | XCZU19EG-2FFVC1760I | Product Type | Zynq UltraScale+ FPGA |
Manufacturer | Xilinx | Logic Cells | 1,196,800 |
Look-Up Tables (LUTs) | 2,393,600 | Flip-Flops | 4,787,200 |
Block RAM (BRAM) | 132,912 KB | Supply Voltage | 0.85V |
Operating Temperature | Industrial (-40°C to +100°C) | Package / Case | FFVC1760 |
Pin Count | 1760 | Package Category | BGA |
Released Date | Apr 3, 2021 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XCZU19EG-2FFVC1760I chip is a System on Chip (SoC) designed by Xilinx. It belongs to the Zynq UltraScale+ family and features a field-programmable gate array (FPGA) along with a processing system, combining the flexibility of programmable logic with the power of ARM processing cores. The chip offers high-performance computing capabilities and is suitable for applications in sectors such as aerospace, defense, automotive, and telecommunications.
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Features
XCZU19EG-2FFVC1760I is an FPGA from Xilinx's Zynq UltraScale+ family. It features a Zynq UltraScale+ MPSoC with a 32-core ARM Cortex-A53 application processor and dual-core ARM Cortex-R5 real-time processors. It offers 1,143,000 programmable logic cells, 6,830 DSP slices, and various I/O options, making it suitable for advanced embedded applications. -
Pinout
The XCZU19EG-2FFVC1760I is an UltraScale+ MPSoC from Xilinx with a pin count of 1760. It integrates a processing system and programmable logic, combining CPUs and FPGA fabric in a single device. The specific function and usage of each pin can be found in the device's datasheet provided by Xilinx. -
Manufacturer
The XCZU19EG-2FFVC1760I is manufactured by Xilinx Inc. It is a multinational semiconductor company that specializes in the development and production of programmable logic devices and related technologies. Xilinx is known for its field-programmable gate arrays (FPGAs) and system on chips (SoCs), which are used in a wide range of applications such as data center acceleration, artificial intelligence, automotive, and aerospace industries. -
Application Field
The XCZU19EG-2FFVC1760I is commonly used in applications such as data center acceleration, artificial intelligence, hardware emulation, and high-performance computing. With its FPGA capabilities, it is well-suited for tasks that require high computational power, accelerated processing, and flexible hardware customization. -
Package
The XCZU19EG-2FFVC1760I chip has a package type of flip-chip ball grid array (FCBGA), its form is 1760-pin and the size of the chip is not explicitly mentioned in the provided information.
Datasheet PDF
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