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Xilinx XCZU19EG-2FFVC1760I

SoC FPGA XCZU19EG-2FFVC1760I

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XCZU19EG-2FFVC1760I

Datasheet: XCZU19EG-2FFVC1760I Datasheet (PDF)

Package/Case: FBGA-1760

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3,168 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XCZU19EG-2FFVC1760I or email to us: Email: [email protected], we will contact you within 12 hours.

XCZU19EG-2FFVC1760I General Description

SoC FPGA XCZU19EG-2FFVC1760ISoC FPGA XCZU19EG-2FFVC1760I

Features

L1 Cache Data Memory: 2 x 32 kB, 4 x 32 kB
Number of Logic Array Blocks - LABs: 65340 LAB
Operating Supply Voltage: 850 mV
Number of Cores: 7 Core
Core: ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2
Embedded Memory: 34.6 Mbit
Minimum Operating Temperature: -40°C
Maximum Clock Frequency: 600 MHz, 667 MHz, 1.5 GHz
Maximum Operating Temperature: +100°C
Package / Case: FBGA-1760
Number of Transceivers: 72 Transceiver
Product Category: SoC FPGA
Adaptive Logic Modules - ALMs: 65340 ALM
Number of Logic Elements: 1143450 LE
L1 Cache Instruction Memory: 2 x 32 kB, 4 x 32 kB
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Manufacturer: Xilinx

AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Product Name XCZU19EG-2FFVC1760I Product Type Zynq UltraScale+ FPGA
Manufacturer Xilinx Logic Cells 1,196,800
Look-Up Tables (LUTs) 2,393,600 Flip-Flops 4,787,200
Block RAM (BRAM) 132,912 KB Supply Voltage 0.85V
Operating Temperature Industrial (-40°C to +100°C) Package / Case FFVC1760
Pin Count 1760 Package Category BGA
Released Date Apr 3, 2021

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XCZU19EG-2FFVC1760I chip is a System on Chip (SoC) designed by Xilinx. It belongs to the Zynq UltraScale+ family and features a field-programmable gate array (FPGA) along with a processing system, combining the flexibility of programmable logic with the power of ARM processing cores. The chip offers high-performance computing capabilities and is suitable for applications in sectors such as aerospace, defense, automotive, and telecommunications.
  • Features

    XCZU19EG-2FFVC1760I is an FPGA from Xilinx's Zynq UltraScale+ family. It features a Zynq UltraScale+ MPSoC with a 32-core ARM Cortex-A53 application processor and dual-core ARM Cortex-R5 real-time processors. It offers 1,143,000 programmable logic cells, 6,830 DSP slices, and various I/O options, making it suitable for advanced embedded applications.
  • Pinout

    The XCZU19EG-2FFVC1760I is an UltraScale+ MPSoC from Xilinx with a pin count of 1760. It integrates a processing system and programmable logic, combining CPUs and FPGA fabric in a single device. The specific function and usage of each pin can be found in the device's datasheet provided by Xilinx.
  • Manufacturer

    The XCZU19EG-2FFVC1760I is manufactured by Xilinx Inc. It is a multinational semiconductor company that specializes in the development and production of programmable logic devices and related technologies. Xilinx is known for its field-programmable gate arrays (FPGAs) and system on chips (SoCs), which are used in a wide range of applications such as data center acceleration, artificial intelligence, automotive, and aerospace industries.
  • Application Field

    The XCZU19EG-2FFVC1760I is commonly used in applications such as data center acceleration, artificial intelligence, hardware emulation, and high-performance computing. With its FPGA capabilities, it is well-suited for tasks that require high computational power, accelerated processing, and flexible hardware customization.
  • Package

    The XCZU19EG-2FFVC1760I chip has a package type of flip-chip ball grid array (FCBGA), its form is 1760-pin and the size of the chip is not explicitly mentioned in the provided information.

Datasheet PDF

Preliminary Specification XCZU19EG-2FFVC1760I PDF Download

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