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Altera 5CSEBA4U23C6N

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SE FPGA - 40K Logic Elements 925MHz 672-UBGA (23x23)

ISO14001 ISO9001 DUNS

Brands: Altera Corporation (Intel)

Mfr.Part #: 5CSEBA4U23C6N

Datasheet: 5CSEBA4U23C6N Datasheet (PDF)

Package/Case: 672-FBGA

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2101 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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5CSEBA4U23C6N General Description

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SE FPGA - 40K Logic Elements 925MHz 672-UBGA (23x23)

Altera Corporation (Intel) Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® V SE feature-process-technology 28nm
feature-maximum-number-of-user-i-os 145 feature-number-of-registers 60376
feature-device-logic-cells 40000 feature-device-system-gates
feature-number-of-multipliers 116 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 2240 feature-total-number-of-block-ram
feature-ethernet-macs 2 feature-supported-ip-core
feature-supported-ip-core-manufacture feature-maximum-number-of-serdes-channels
feature-device-logic-units 40000 feature-device-number-of-dlls-plls 5
feature-transceiver-blocks feature-transceiver-speed-gbps
feature-dedicated-dsp 58 feature-pci-blocks
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 6 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported LVPECL|LVDS feature-single-ended-i-o-standards-supported LVTTL|LVCMOS
feature-external-memory-interface DDR2 SDRAM|DDR3 SDRAM|LPDDR2 feature-minimum-operating-supply-voltage-v 1.07
feature-maximum-operating-supply-voltage-v 1.13 feature-packaging Tray
feature-rohs feature-rad-hard
feature-pin-count 672 feature-supplier-package UFBGA
feature-standard-package-name1 BGA feature-cecc-qualified
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code EAR99
feature-svhc No feature-svhc-exceeds-threshold No
Series Cyclone® V SE Package Tray
Product Status Active Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ RAM Size 64KB
Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 925MHz Primary Attributes FPGA - 40K Logic Elements
Operating Temperature 0°C ~ 85°C (TJ) Package / Case 672-FBGA
Supplier Device Package 672-UBGA (23x23)

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The 5CSEBA4U23C6N chip is a field-programmable gate array (FPGA) developed by Intel Corporation. It belongs to the Cyclone V family and offers a high level of performance and power efficiency. This chip integrates reconfigurable logic, digital signal processing (DSP), and memory resources, making it suitable for a wide range of applications such as industrial automation, image processing, and communications.
  • Features

    The 5CSEBA4U23C6N is a Cyclone V FPGA from Intel with 23,264 LEs, 3.66 Mbits of RAM, and 2,480 multipliers. It operates with a core speed of 500 MHz, supports various I/O standards, and has built-in high-speed transceivers. The FPGA offers low power consumption, high performance, and flexibility for a range of applications.
  • Pinout

    The 5CSEBA4U23C6N is an Altera Cyclone V FPGA IC package with a 672-pin count. It is commonly used in applications such as industrial automation, aerospace, and automotive, offering flexible programmability and reliable performance. It provides a wide range of functions, including logic elements, memory blocks, DSP capabilities, and high-speed I/O interfaces.
  • Manufacturer

    Intel is the manufacturer of the 5CSEBA4U23C6N. It is a multinational semiconductor company that designs and manufactures microprocessors, system-on-chips, and other technology-based products for a wide range of industries, including computing, communications, and industrial automation.
  • Application Field

    The 5CSEBA4U23C6N is a field-programmable gate array (FPGA) chip that can be used in various applications such as aerospace and defense systems, industrial automation, video and image processing, and communications. It provides flexible and customizable solutions for complex digital designs in these fields and more.
  • Package

    The 5CSEBA4U23C6N chip has a ball grid array (BGA) package type, with a form factor of 484 balls. Its size is around 23mm x 23mm, making it a compact and space-efficient chip.

Datasheet PDF

Preliminary Specification 5CSEBA4U23C6N PDF Download

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