Altera 5CEFA9F27I7N

Part points

• The 5CEFA9F27I7N chip is a field-programmable gate array (FPGA) from Intel. It offers high performance and flexibility for various applications in areas such as telecommunications, industrial automation, and aerospace. With a high-speed transceiver technology, this chip enables high-speed data transfer and processing. It also provides a range of on-chip resources, making it suitable for complex designs and system integration.

• Equivalent

  The equivalent products of the 5CEFA9F27I7N chip are the Stratix IV FPGA family, specifically the models 5CEFA4F27I7N, 5CEFA6F27I7N, and 5CEFA7F27I7N.

• Features

  The main features of the 5CEFA9F27I7N are: 1. FPGA (Field-Programmable Gate Array) device 2. Contains 27,280 logic elements 3. Equipped with 862,720 bits of internal RAM 4. Integrated with 540 multipliers 5. Offers advanced I/O capabilities with up to 672 I/O pins 6. Supports high-speed data transfer with up to 3.125Gbps transceivers 7. Powered by low power consumption design, suitable for various applications.

• Pinout

  The 5CEFA9F27I7N is a field-programmable gate array (FPGA) from the Cyclone V E series by Intel. It has a pin count of 672 and supports various functions, including programmable logic, digital signal processing, embedded memory, and high-speed I/O interfaces.

• Manufacturer

  The manufacturer of the 5CEFA9F27I7N is Intel Corporation. Intel is an American multinational technology company specializing in the design and manufacturing of a wide range of computing and communication devices, including microprocessors, chipsets, and other semiconductor products.

• Application Field

  The 5CEFA9F27I7N is a field-programmable gate array (FPGA) device manufactured by Intel (formerly Altera). It is used in various application areas including wireless communication, automotive, industrial automation, and aerospace. It provides customizable hardware solutions and high-performance processing capabilities for these industries.

• Package

  The 5CEFA9F27I7N chip is available in a ball grid array (BGA) package type. It has a form referred to as FBGA (fine-pitch BGA) and has a size of 780-ball grid array (780-BGA).