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Altera 5CGXFC7D6F31C6N
FPGA Cyclone® V GX Family 149500 Cells 28nm Technology 1.1V 896-Pin FBGA
Brands: Altera Corporation (Intel)
Mfr.Part #: 5CGXFC7D6F31C6N
Datasheet: 5CGXFC7D6F31C6N Datasheet (PDF)
Package/Case: FBGA-896
RoHS Status:
Stock Condition: 2404 pcs, New Original
Product Type: Programmable Logic ICs
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1
*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $1336.632 | $1336.632 |
| 189 | $533.326 | $100798.614 |
| 513 | $515.504 | $264453.552 |
| 999 | $506.697 | $506190.303 |
In Stock:2404 PCS
5CGXFC7D6F31C6N General Description
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 480 7880704 149500 896-BGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| feature-family-name | Cyclone® V GX | feature-process-technology | 28nm |
| feature-maximum-number-of-user-i-os | 480 | feature-number-of-registers | 225920 |
| feature-device-logic-cells | 149500 | feature-device-system-gates | |
| feature-number-of-multipliers | 312 (18x18) | feature-program-memory-type | SRAM |
| feature-ram-bits-kbit | 6860 | feature-total-number-of-block-ram | 686 |
| feature-ethernet-macs | 2 | feature-supported-ip-core | |
| feature-supported-ip-core-manufacture | feature-maximum-number-of-serdes-channels | ||
| feature-device-logic-units | 149500 | feature-device-number-of-dlls-plls | 7 |
| feature-transceiver-blocks | 9 | feature-transceiver-speed-gbps | 3.125 |
| feature-dedicated-dsp | 156 | feature-pci-blocks | 2 |
| feature-programmability | Yes | feature-maximum-internal-frequency-mhz | |
| feature-speed-grade | 6 | feature-giga-multiply-accumulates-per-second | |
| feature-differential-i-o-standards-supported | LVPECL|LVDS | feature-single-ended-i-o-standards-supported | LVTTL|LVCMOS |
| feature-external-memory-interface | DDR2 SDRAM|DDR3 SDRAM|LPDDR2 | feature-minimum-operating-supply-voltage-v | 1.07 |
| feature-maximum-operating-supply-voltage-v | 1.13 | feature-packaging | |
| feature-rohs | feature-rad-hard | ||
| feature-pin-count | 896 | feature-supplier-package | FBGA |
| feature-standard-package-name1 | BGA | feature-cecc-qualified | No |
| feature-esd-protection | feature-escc-qualified | ||
| feature-military | No | feature-aec-qualified | No |
| feature-aec-qualified-number | feature-auto-motive | No | |
| feature-p-pap | No | feature-eccn-code | 3A991 |
| feature-svhc | No |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The 5CGXFC7D6F31C6N chip is a high-performance FPGA chip from Intel that is ideal for a wide range of applications, including networking, telecommunications, and industrial automation. It features a large number of configurable logic elements, high-speed transceivers, and advanced signal processing capabilities, making it a versatile solution for complex designs.
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Equivalent
Some possible equivalent products of the 5CGXFC7D6F31C6N chip are the 5CGXFC7D6F31I7N, 5CGXFC7D6F31C6, and 5CGXFC7G6F31C6N chips. These chips are all part of the Intel Cyclone V series of field-programmable gate arrays (FPGAs) and offer similar features and performance capabilities. -
Features
The 5CGXFC7D6F31C6N is a low-cost, low-power FPGA with 622K LEs, 29.9 Mb RAM, and 26.6 Gbps transceiver bandwidth. It features advanced security features, flexible clocking options, PCIe Gen2 x4 capability, and support for various I/O standards. This FPGA is ideal for applications in communications, industrial, automotive, and defense sectors. -
Pinout
The pin count of the 5CGXFC7D6F31C6N is 672. It is a Cyclone V FPGA with 65k logic elements, 4291 Kbits embedded memory, and 216 18x18 multipliers. It is designed for high-performance applications such as communications infrastructure, industrial automation, and automotive. -
Manufacturer
5CGXFC7D6F31C6N is a product of Intel Corporation, a multinational technology company that specializes in manufacturing semiconductor chips and other computer-related products. Intel is one of the world's largest and highest valued semiconductor chip makers based on its revenue and is the inventor of the x86 series of microprocessors which power most personal computers. -
Application Field
Industrial automation, automotive systems, telecommunications, high-speed networking, and medical imaging are some of the application areas of the 5CGXFC7D6F31C6N field-programmable gate array (FPGA). Its high processing power, flexibility, and reliability make it suitable for a wide range of embedded systems and high-performance computing applications. -
Package
The 5CGXFC7D6F31C6N chip comes in a Ball Grid Array (BGA) package type with a form factor of 1152-BGA. It has a size of 31mm x 31mm.
Datasheet PDF
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