Xilinx XCV150-4BG352I

Part points

• The XCV150-4BG352I chip is a Field Programmable Gate Array (FPGA) designed by Xilinx. It offers high performance and flexibility for various applications. It has 150,000 logic cells and operates on a 4.5-volt power supply. The chip is housed in a 352-pin Ball Grid Array (BGA) package, making it suitable for advanced electronic systems requiring programmable logic functionality.

• Equivalent

  There are no direct equivalent products to the XCV150-4BG352I chip. However, other similar FPGA chips in the Xilinx Virtex series, such as XCV1000, XCV2000, or XCV3000, may offer alternative options depending on the specific requirements and features needed.

• Features

  The XCV150-4BG352I is an FPGA with 150,000 system gates, 62 I/O pins, and a 4ns propagation delay. It has a 180nm CMOS process technology, PowerPC405 microprocessor core, and operates at a voltage of 1.8V. It includes 512KB of dual-ported RAM, three clock tiles, and supports JTAG programming and debugging.

• Pinout

  The XCV150-4BG352I is an FPGA with 352 pins. It is part of the Xilinx Virtex family and has 150,000 system gates. The pin count refers to the number of electrical connections the chip has, while the function relates to the various purposes its pins serve in the device's operation.

• Manufacturer

  The XCV150-4BG352I is manufactured by Xilinx Inc., a company that specializes in the development and production of programmable logic devices and related software tools. It is a leading provider of field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs) used in various industries including aerospace, automotive, data center, and telecommunications.

• Application Field

  The XCV150-4BG352I is an FPGA (Field Programmable Gate Array) used in various application areas such as telecommunications, aerospace, automotive, industrial automation, and medical devices. It is particularly suitable for applications requiring high-speed data processing, signal processing, and complex logic functions.

• Package

  The XCV150-4BG352I chip has a Ball Grid Array (BGA) package type, a 352-pin implementation of the BGA form, and its size is measured at 35 mm x 35 mm.