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$5000Xilinx XC7K70T-2FBG484I
FPGA - Field Programmable Gate Array XC7K70T-2FBG484I
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7K70T-2FBG484I
Datasheet: XC7K70T-2FBG484I Datasheet (PDF)
Package/Case: BGA-484
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 3,944 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC7K70T-2FBG484I General Description
FPGA, KINTEX-7, 285 I/O, FCBGA-484; No. of Logic Blocks:10250; No. of Macrocells:65600Macrocells; FPGA Family:Kintex-7; Logic Case Style:FCBGA; No. of Pins:484Pins; No. of Speed Grades:2; Total RAM Bits:4860Kbit; MSL:- RoHS Compliant: Yes
Features
IC FPGA 285 I/O 484FCBGAIC FPGA 285 I/O 484FCBGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pin Count | 484 | Package Category | BGA |
| Released Date | May 7, 2020 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7K70T-2FBG484I is a chip from Xilinx's 7 series FPGAs. It is built on a 28-nanometer process and offers enhanced performance and power efficiency compared to previous generations. With 70,000 logic cells and 2,560 KB of block RAM, it provides significant resources for complex digital designs. The '2FBG484I' denotes the specific package type and number of available I/O pins.
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Equivalent
Some equivalent products of the XC7K70T-2FBG484I chip include the XC7K70T-2FBG484C, XC7K70T-3FBG484I, XC7K70T-3FBG484C, and XC7K70T-2FFG484I chips. -
Features
XC7K70T-2FBG484I is a Xilinx Kintex-7 FPGA. It has 70,000 logic cells and 2,920 Kb of block RAM. It supports a total of 136 DSP slices and 240 user I/Os. The device operates at a maximum speed of 840MHz and provides reliable performance for various applications, including automotive, industrial, and aerospace. -
Pinout
The XC7K70T-2FBG484I is an FPGA with a 484-ball BGA package. The pin count of the device is 484. The specific function of each pin will depend on the configuration of the FPGA and the design implemented on it. -
Manufacturer
The manufacturer of the XC7K70T-2FBG484I is Xilinx. Xilinx is a technology company specializing in the development and production of programmable logic devices and associated software tools. They are known for their field-programmable gate arrays (FPGAs), which are widely used in a range of industries including telecommunications, automotive, aerospace, and more. -
Application Field
The XC7K70T-2FBG484I is a field-programmable gate array (FPGA) which can be used in various applications such as wireless communications, aerospace and defense systems, industrial automation, and high-performance computing. Its versatile design and advanced features make it suitable for a wide range of applications requiring fast and efficient processing capabilities. -
Package
The XC7K70T-2FBG484I chip has a package type known as a Ball Grid Array (BGA). Its form is a 484- ball package, and its size is characterized as 23mm x 23mm.
Datasheet PDF
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