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Xilinx XC6SLX150T-3FGG676C

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 396 4939776 147443 676-BGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC6SLX150T-3FGG676C

Datasheet: XC6SLX150T-3FGG676C Datasheet (PDF)

Package/Case: FBGA-676

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,700 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC6SLX150T-3FGG676C or email to us: Email: [email protected], we will contact you within 12 hours.

XC6SLX150T-3FGG676C General Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 396 4939776 147443 676-BGA

xc6slx150t-3fgg676c

Features

  • It has 147,443 logic cells
  • It has 7,813 Kbits of Block RAM
  • It has 360 DSP slices
  • It has 784 user I/Os
  • It operates at a maximum frequency of 550 MHz

Application

  • Communication systems
  • Video and image processing
  • High-performance computing
  • Industrial automation
  • Aerospace and defense
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array
RoHS: Y Product: Spartan-6
Number of Logic Elements: 147443 Number of I/Os: 396 I/O
Operating Supply Voltage: 1.2 V Minimum Operating Temperature: 0 C
Maximum Operating Temperature: + 85 C Mounting Style: SMD/SMT
Package / Case: FBGA-676 Data Rate: 800 Mb/s
Series: XC6SLX150T Brand: Xilinx
Distributed RAM: 1355 kbit Embedded Block RAM - EBR: 4824 kbit
Maximum Operating Frequency: 1080 MHz Moisture Sensitive: Yes
Number of Transceivers: 8 Transceiver Product Type: FPGA - Field Programmable Gate Array
Factory Pack Quantity: 40 Subcategory: Programmable Logic ICs
Tradename: Spartan

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC6SLX150T-3FGG676C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC6SLX150T-2FGG676C

Brands :  

Package :   BGA676

Description :   FPGA Spartan®-6 LXT Family 147443 Cells 45nm (CMOS) Technology 1.2V 676Pin FBGA

Part Number :   XC6SLX150T-2CSG484C

Brands :  

Package :   484-FBGA, CSPBGA

Description :   FPGA Spartan?-6 LXT Family 147443 Cells 45nm Technology 1.2V 484-Pin CSBGA

Part Number :   XC6SLX150T-2FG676C

Brands :  

Package :  

Description :  

Part Number :   XC6SLX150T-2FGG900C

Brands :  

Package :   BGA-900

Description :   FPGA Spartan?-6 LXT Family 147443 Cells 45nm Technology 1.2V 900-Pin FBGA

Part Number :   XC6SLX150T-2FGG484C

Brands :  

Package :   BGA484

Description :   FPGA Spartan®-6 LXT Family 147443 Cells 45nm (CMOS) Technology 1.2V 484Pin FBGA

Part points

  • The XC6SLX150T-3FGG676C chip is a Field Programmable Gate Array (FPGA) from Xilinx. It belongs to the Spartan-6 family and has 147,443 logic cells. The chip operates at a speed grade of -3, supports LVCMOS and LVTTL interfaces, and has 676 pins arranged in a Fine-Pitch Ball Grid Array (FBGA) package. It is widely used in various applications requiring high-performance and flexible hardware solutions.
  • Equivalent

    Some equivalent products for the XC6SLX150T-3FGG676C chip include the XC6SLX150T-3FGG484C and the XC6SLX150T-3FGG484I, both of which belong to the same Xilinx Spartan-6 family and have similar specifications and functionality.
  • Features

    The XC6SLX150T-3FGG676C is an FPGA with 147,443 logic cells, 434,000 configurable flip-flops, 2.1 Mbits of block RAM, and 532 multipliers. It operates at a maximum frequency of 550 MHz, has 16 global clock buffers, and supports high-performance memory interfaces like DDR2, DDR3, and QDR II+. It also features SelectI/O technology for high-speed I/O interfacing.
  • Pinout

    The XC6SLX150T-3FGG676C is an FPGA (Field-Programmable Gate Array) device. It has 676 pins and belongs to the Spartan-6 LX family by Xilinx. The specific pin functions vary depending on the user's configuration and design implementation.
  • Manufacturer

    The manufacturer of the XC6SLX150T-3FGG676C is Xilinx. Xilinx is a leading American technology company that specializes in the design and production of field-programmable gate arrays (FPGAs) and related products.
  • Application Field

    The XC6SLX150T-3FGG676C is a field-programmable gate array (FPGA) that is commonly used in various applications such as industrial automation, telecommunications, aerospace, and defense. It offers high-performance logic and signal processing capabilities, making it suitable for complex systems that require reliable and flexible programmable hardware.
  • Package

    The XC6SLX150T-3FGG676C chip comes in a Ball Grid Array (BGA) package with 676 pins. It has a form factor of 27mm x 27mm.

Datasheet PDF

Preliminary Specification XC6SLX150T-3FGG676C PDF Download

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