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$5000Xilinx XC5VLX155-1FFG1153I
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 7077888 155648 1153-BBGA, FCBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC5VLX155-1FFG1153I
Datasheet: XC5VLX155-1FFG1153I Datasheet (PDF)
Package/Case: BGA-1153
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 3,629 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC5VLX155-1FFG1153I General Description
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 7077888 155648 1153-BBGA, FCBGA
Specifications
Parameter | Value | Parameter | Value |
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Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
RoHS: | Y | Product: | Virtex-6 |
Number of Logic Elements: | 314880 | Number of I/Os: | 600 I/O |
Operating Supply Voltage: | 1 V | Minimum Operating Temperature: | 0 C |
Maximum Operating Temperature: | + 85 C | Mounting Style: | SMD/SMT |
Package / Case: | FCBGA-1156 | Data Rate: | 6.6 Gb/s |
Series: | XC6VSX315T | Brand: | Xilinx |
Distributed RAM: | 5090 kbit | Embedded Block RAM - EBR: | 25344 kbit |
Maximum Operating Frequency: | 1600 MHz | Number of Transceivers: | 24 Transceiver |
Product Type: | FPGA - Field Programmable Gate Array | Factory Pack Quantity: | 1 |
Subcategory: | Programmable Logic ICs | Tradename: | Virtex |
Tags | XC5VLX155-1FFG115, XC5VLX155-1FFG11, XC5VLX155-1FFG, XC5VLX155-1, XC5VLX155, XC5VLX15, XC5VLX1, XC5VLX, XC5VL, XC5V, XC5 | Rohs Code | Yes |
Part Life Cycle Code | Transferred | Ihs Manufacturer | XILINX INC |
Part Package Code | BGA | Package Description | BGA-1153 |
Pin Count | 1153 | Reach Compliance Code | compliant |
ECCN Code | 3A001.A.7.A | HTS Code | 8542.39.00.01 |
Samacsys Manufacturer | XILINX | Combinatorial Delay of a CLB-Max | 0.9 ns |
JESD-30 Code | S-PBGA-B1153 | JESD-609 Code | e1 |
Length | 35 mm | Moisture Sensitivity Level | 4 |
Number of CLBs | 12160 | Number of Inputs | 800 |
Number of Logic Cells | 155648 | Number of Outputs | 800 |
Number of Terminals | 1153 | Operating Temperature-Max | 100 °C |
Operating Temperature-Min | -40 °C | Organization | 12160 CLBS |
Package Body Material | PLASTIC/EPOXY | Package Code | BGA |
Package Equivalence Code | BGA1153,34X34,40 | Package Shape | SQUARE |
Package Style | GRID ARRAY | Peak Reflow Temperature (Cel) | 245 |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | Qualification Status | Not Qualified |
Seated Height-Max | 3.4 mm | Supply Voltage-Max | 1.05 V |
Supply Voltage-Min | 0.95 V | Supply Voltage-Nom | 1 V |
Surface Mount | YES | Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC5VLX155-1FFG1153I chip is a high-performance field-programmable gate array (FPGA) developed by Xilinx. It provides a versatile platform for implementing complex digital designs and offers extensive resources for designs with high-speed interfaces and data processing requirements. With its powerful capabilities and large capacity, the chip is widely used in a variety of applications, including telecommunications, aerospace, and scientific research.
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Equivalent
Some equivalent products to the XC5VLX155-1FFG1153I chip include the XC5VLX110-1FFG1153I, XC5VLX155-1FF676C, and XC5VLX155-2FFG1153I. -
Features
XC5VLX155-1FFG1153I is a Field Programmable Gate Array (FPGA) with 155,000 logic cells and 800MHz processing speed. It has 1,045 inputs and 862 outputs, with 960 I/O pins and 24 differential I/O pairs. It offers integrated power management, 1.2V core voltage, and supports various interfaces like PCI Express, Gigabit Ethernet, and more. -
Pinout
The XC5VLX155-1FFG1153I has a pin count of 1153 and is a field-programmable gate array (FPGA) belonging to the Xilinx Virtex-5 LX family. It features 155,000 logic cells and various I/O interfaces, making it suitable for high-performance applications such as telecommunications, aerospace, and defense. -
Manufacturer
The manufacturer of the XC5VLX155-1FFG1153I is Xilinx. Xilinx is a technology company specializing in the development of programmable logic devices and related software. They are known for their field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs), which are widely used in various applications such as telecommunications, automotive, aerospace, and more. -
Application Field
The XC5VLX155-1FFG1153I is a high-performance FPGA (Field-Programmable Gate Array) suitable for a range of applications including aerospace and defense, industrial automation, telecommunications, automotive, and medical devices. Its features, such as high-speed interfaces, logic capacity, and robust design, make it ideal for complex and demanding systems. -
Package
The XC5VLX155-1FFG1153I is a Field Programmable Gate Array (FPGA) chip. The package type is Flip-Chip 1153-Ball, and it has a size of 33x33 mm.
Datasheet PDF
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