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Xilinx XC3S700A-4FGG484I
Product XC3S700A-4FGG484I is a ROHS compliant FBGA-484 Programmable Logic Device
Brands: Xilinx
Mfr.Part #: XC3S700A-4FGG484I
Datasheet: XC3S700A-4FGG484I Datasheet (PDF)
Package/Case: FCBGA-484
RoHS Status:
Stock Condition: 2,946 pcs, New Original
Product Type: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $149.449 | $149.449 |
| 200 | $57.836 | $11567.200 |
| 500 | $55.804 | $27902.000 |
| 1000 | $54.798 | $54798.000 |
In Stock: 2,946 PCS
XC3S700A-4FGG484I General Description
Spartan®-3A Field Programmable Gate Array (FPGA) IC 372 368640 13248 484-BBGA
Features
- It has 700K system gates, which represents the number of logic cells or functional blocks in the FPGA.
- It has 92,160 logic cells, 2,520Kbits of block RAM, and 228 DSP48A1 slices.
- It has a 4-input look-up table (LUT) architecture, which allows for flexible logic implementation.
- It supports up to 500MHz clock frequency.
- It has various I/O standards, including LVCMOS, LVTTL, HSTL, SSTL, and LVDS.
- It operates on a 1.2V core voltage and can interface with 1.5V to 3.3V I/O standards.
- It is housed in a Fine-Pitch Ball Grid Array (FBGA) package.
Application
- Digital signal processing
- High-speed networking
- Video and image processing
- Aerospace and defense systems
- Industrial control and automation
- Test and measurement equipment
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
| Series | XC3S700A | Number of Logic Elements | 13248 LE |
| Adaptive Logic Modules - ALMs | 5888 ALM | Embedded Memory | 360 kbit |
| Number of I/Os | 372 I/O | Supply Voltage - Min | 1.14 V |
| Supply Voltage - Max | 1.26 V | Minimum Operating Temperature | - 40 C |
| Maximum Operating Temperature | + 100 C | Mounting Style | SMD/SMT |
| Package / Case | FCBGA-484 | Brand | Xilinx |
| Distributed RAM | 92 kbit | Embedded Block RAM - EBR | 360 kbit |
| Moisture Sensitive | Yes | Number of Gates | 700000 |
| Operating Supply Voltage | 1 V | Product Type | FPGA - Field Programmable Gate Array |
| Factory Pack Quantity | 1 | Subcategory | Programmable Logic ICs |
| Tradename | Spartan |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S700A-4FGG484I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S700A-4FTG256C
Brands :
Package : 256-FTBGA
Description : Extended Spartan-3A FPGAs, Package: 4FTG256C
Part Number : XC3S700A-4FTG256I
Brands :
Package : 256-FTBGA
Description : FPGA Spartan -3A Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V 256Pin FTBGA
Part Number : XC3S700A-4VQG100C
Brands :
Package :
Description :
Part Number : XC3S700A-4VQG100I
Brands :
Package :
Description :
Part Number : XC3S700A-4VQG144C
Brands :
Package :
Description :
Part Number : XC3S700A-4VQG144I
Brands :
Package :
Description :
Part Number : XC3S700A-4VQG196C
Brands :
Package :
Description :
Part Number : XC3S700A-4VQG196I
Brands :
Package :
Description :
Part points
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The XC3S700A-4FGG484I chip is a field-programmable gate array (FPGA) that belongs to the Spartan-3A series by Xilinx. It offers a high-performance and low-cost solution for designing and implementing digital circuits. The "4FGG484I" designation refers to the specific package and pin configuration of the chip. It has 700,000 system gates and is based on the 90nm process technology.
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Equivalent
Some equivalent products of the XC3S700A-4FGG484I chip are XC3S700A-4FTG256I, XC3S700A-4FGG484C, XC3S700A-4VQG100C, and XC3S700A-4VQG100I, all belonging to the Xilinx Spartan-3A FPGA family. -
Features
The XC3S700A-4FGG484I is a field-programmable gate array (FPGA) device. It has 700,000 system gates, operates at a speed of up to 550 MHz, and comes in a 484-ball fine-pitch ball grid array (FBGA) package. It offers advanced features such as integrated block RAM and high-performance DSP blocks, making it suitable for a wide range of applications. -
Pinout
The XC3S700A-4FGG484I is a field-programmable gate array (FPGA) with a pin count of 484. It is used for digital logic applications and offers various functions, including data processing, signal routing, and memory management. -
Manufacturer
The manufacturer of the XC3S700A-4FGG484I is Xilinx Inc. Xilinx is a US-based technology company that specializes in the design and manufacture of programmable logic devices, such as field-programmable gate arrays (FPGAs) and semiconductor products. -
Application Field
The XC3S700A-4FGG484I is an FPGA (Field Programmable Gate Array) device that is commonly used in various application areas such as aerospace and defense, wireless communication, industrial automation, and consumer electronics. It offers high-speed processing and flexible reconfigurability, making it suitable for a wide range of applications. -
Package
The XC3S700A-4FGG484I chip has a Fine-pitch Ball Grid Array (FBGA) package type, a grid array form, and a package size of 23mm x 23mm with 484 pins.
Datasheet PDF
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