This website uses cookies. By using this site, you consent to the use of cookies. For more information, please take a look at our Privacy Policy.

Orders Over

$5000
Get a $50 Discount!

Xilinx XC3S400-4FGG456C

Spartan®-3 Field Programmable Gate Array (FPGA) IC 264 294912 8064 456-BBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S400-4FGG456C

Datasheet: XC3S400-4FGG456C Datasheet (PDF)

Package/Case: BGA456

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,896 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC3S400-4FGG456C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S400-4FGG456C General Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 264 294912 8064 456-BBGA

xc3s400-4fgg456c

Features

  • 400,000 system gates
  • 492 user I/Os
  • 36KB block RAM
  • 4 Digital Clock Managers (DCMs)
  • 352 I/O pins that support LVCMOS 3.3V, LVCMOS 2.5V, LVTTL, HSTL, SSTL, and PCI standards
  • Supports configuration through boundary scan, Slave-Serial, or SelectMAP mode

Application

  • Digital signal processing
  • Industrial control
  • Networking
  • Medical equipment
  • Automotive electronics
  • Defense and aerospace
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Case/Package FBGA Mount Surface Mount
Number of Pins 456 Max Operating Temperature 85 °C
Min Operating Temperature 0 °C Number of Gates 400000
Number of I/Os 264 Number of Logic Blocks (LABs) 896
Number of Logic Elements/Cells 8064 Operating Supply Voltage 1.2 V
Packaging Bulk RAM Size 36 kB
Speed Grade 4

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S400-4FGG456C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S400-4PQ208C

Brands :  

Package :   QFP208

Description :   FPGA, 896 CLBS, 400000 GATES, 630 MHZ, PQFP208

Part Number :   XC3S400-4FTG256C

Brands :  

Package :   BGA-256

Description :   FPGA Spartan®-3 Family 400K Gates 8064 Cells 630MHz 90nm Technology 1.2V

Part Number :   XC3S400-4TQG144C

Brands :  

Package :   TQFP-144

Description :   FPGA Spartan-3 Family 400K Gates 8064 Cells 630MHz 90nm Technology 1.2V

Part Number :   XC3S400-4PQG208C

Brands :  

Package :   QFP208

Description :   400K Gates 8064 Cells 630MHz 90nm Technology 1.2V

Part Number :   XC3S400-4FGG676C

Brands :  

Package :  

Description :  

Part points

  • XC3S400-4FGG456C is a programmable logic device (PLD) from Xilinx, an FPGA manufacturer. It belongs to the Spartan-3E family and offers 400,000 system gates. This chip provides flexible and customizable digital logic functionality for various applications. It comes in a FG456 package, features 4-input look-up tables, and supports a wide range of I/O standards. The XC3S400-4FGG456C chip enables efficient and reliable implementation of complex digital designs.
  • Equivalent

    Some of the equivalent products of the XC3S400-4FGG456C chip are the Xilinx XC3S400A-4FTG256C, XC3S400A-4FGG320C, and the XC3S400A-4FTG256I.
  • Features

    The XC3S400-4FGG456C is a Field-Programmable Gate Array (FPGA) with 400,000 system gates, offering 456 I/O pins. It operates under a supply voltage of 1.14 to 1.26 volts and has a clock frequency up to 250 MHz. It provides features like high-performance, low-power consumption, and advanced logic capabilities for various applications.
  • Pinout

    The XC3S400-4FGG456C is an FPGA (Field Programmable Gate Array) chip manufactured by Xilinx. It has a pin count of 456 pins and contains 400,000 logic cells. The specific pin functions will depend on the implementation and design of the FPGA.
  • Manufacturer

    The manufacturer of the XC3S400-4FGG456C is Xilinx Inc. It is a leading company in the field of programmable logic devices and embedded platforms. They specialize in developing and manufacturing field-programmable gate arrays (FPGAs), designing integrated circuits, and providing software development tools for a wide range of applications in various industries.
  • Application Field

    The XC3S400-4FGG456C is a field-programmable gate array (FPGA) that is commonly used in various applications including industrial automation, telecommunications, data centers, and aerospace. It offers a high level of flexibility and programmability, making it suitable for a wide range of applications that require advanced digital signal processing and high-speed data processing capabilities.
  • Package

    The XC3S400-4FGG456C chip is available in a Ball Grid Array (BGA) package type. It is in a 456-pin fine pitch form, with a size of approximately 27mm x 27mm.

Datasheet PDF

Preliminary Specification XC3S400-4FGG456C PDF Download

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

Ratings and Reviews

Ratings
Please rate the product !
Please enter a comment

Please submit comments after logging into your account.

Submit

Recommend