Xilinx XC2V3000-4FG676I

Part points

• XC2V3000-4FG676I is a microchip manufactured by Xilinx. It is a Field Programmable Gate Array (FPGA) with a capacity of 3 million system gates. The chip has 3000 digital input/output pins and comes in a 676-pin Fine Grain Ball Grid Array (FBGA) package. It is used in various applications that require high-speed data processing and programmable logic capabilities.

• Features

  XC2V3000-4FG676I is a programmable logic device by Xilinx. It has 3 million system gates and is packaged in a 676-pin FineLine BGA. The device operates at a 400MHz maximum frequency with a 4ns maximum output delay. It offers high-performance I/Os, abundant memory, and a variety of built-in features for efficient design implementation.

• Pinout

  The XC2V3000-4FG676I is a Field-Programmable Gate Array (FPGA) with 676 pins. Its specific pin functions and count can vary depending on the specific package and configuration. For detailed information, please refer to the datasheet or specifications provided by the manufacturer.

• Manufacturer

  The manufacturer of the XC2V3000-4FG676I is the Xilinx Corporation. Xilinx is an American technology company specializing in the development and manufacturing of programmable logic devices, including field-programmable gate arrays (FPGAs), intellectual property cores, and development software.

• Application Field

  The XC2V3000-4FG676I is an FPGA (Field-Programmable Gate Array) used in various applications including aerospace, defense, automotive, telecommunications, medical equipment, and industrial automation. It can be utilized for tasks such as signal processing, data encryption, image recognition, and system control.

• Package

  The XC2V3000-4FG676I chip is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. The form factor and size of the chip are dependent on the specific requirements of the package, but in this case, it is safe to assume that the chip is relatively compact due to its fine-pitch design.