Xilinx XC2S100-5FGG256C

Part points

• The XC2S100-5FGG256C is a field-programmable gate array (FPGA) chip. It belongs to the Xilinx Spartan-2 series and is designed for high-performance applications. The chip has a capacity of 100,000 system gates, with numerous built-in features and resources that enable flexible and efficient digital design and implementation. It operates at a speed grade of -5 and comes in a 256-ball fine-pitch ball grid array (FBGA) package.

• Equivalent

  XC2S100-5FGG256C is a Xilinx Spartan-IIE FPGA chip with 100,000 system gates, operating at 5V in a FG256 package. Equivalent products to consider are XCR3128XL-10VQG100C, XCR3128XL-7VQG100C, XC2S100-5FGG324I, XC2S100-5FGG324C, XC2S100-5FGG324, XC2S100-5TG144C, XC2S100-5FGG324I, XC2S100-5TQ144I, XC2S100-5FGG256C-DS and XC2S100-5FGG256I.

• Features

  The XC2S100-5FGG256C is an integrated circuit with 100,160 logic cells, a maximum of 393,216 system gates, and 4,608 logic slices. It operates at 5V, has a maximum frequency of 179MHz, and supports 5V and 2.5V I/O standards. It also includes 20 dedicated multipliers and various features for configuration and programming.

• Pinout

  The XC2S100-5FGG256C is an FPGA (Field Programmable Gate Array) device with a pin count of 256. It can be programmed to perform various digital functions and is commonly used in digital logic designs, communication systems, and other applications where configurable hardware is required.

• Manufacturer

  The manufacturer of the XC2S100-5FGG256C is Xilinx. It is a technology company that specializes in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs).

• Application Field

  The XC2S100-5FGG256C is a field programmable gate array (FPGA) device designed by Xilinx. It is commonly used in applications such as industrial control systems, consumer electronics, communication devices, and automotive systems. Its versatility and advanced features make it suitable for various areas that require programmable logic devices.

• Package

  The XC2S100-5FGG256C chip is available in a fine-pitch ball grid array (FBGA) package. It has a 256-ball grid array with a form factor of 13mm x 13mm.