Infineon TLE6251-3G
1/1 Transceiver Half CANbus PG-DSO-14
Brands: Infineon Technologies Corporation
Mfr.Part #: TLE6251-3G
Datasheet: TLE6251-3G Datasheet (PDF)
Package/Case: SOP-14
RoHS Status:
Stock Condition: 2248 pcs, New Original
Product Type: Interface ICs
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $2.661 | $2.661 |
200 | $1.031 | $206.200 |
500 | $0.993 | $496.500 |
1000 | $0.977 | $977.000 |
In Stock:2248 PCS
TLE6251-3G General Description
As a successor of the TLE6251G, the TLE6251-3G is designed to provide an excellent passive behavior in Power Down . This feature makes the TLE6251-3G extremely suitable for mixed power supply HS-CAN networks. The TLE6251-3G provides different operation modes with a very low quiescent current in Sleep mode. Based on the high symmetry of the CANH and CANL signals, the TLE6251-3G provides a very low level of electromagnetic emission (EME) within a broad frequency range. The TLE6251-3G is integrated in a RoHS compliant PG-DSO-14 package and fulfills or exceeds the requirements of the ISO11898-5. The TLE6251G and the TLE6251-3G are fully pin compatible and function compatible. Based on the Infineon Smart Power Technology SPT®, the TLE6251-3G provides industry leading ESD robustness together with a very high electromagnetic immunity (EMI). The Infineon Smart Power Technology SPT® allows bipolar and CMOS control circuitry in accordance with DMOS power devices to exist on the same monolithic circuit. The TLE6251-3G and the Infineon SPT® technology are AEC qualified and tailored to withstand the harsh conditions of the automotive environment
Specifications
Parameter | Value | Parameter | Value |
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Manufacturer: | Infineon | Product Category: | CAN Interface IC |
RoHS: | Details | Series: | TLE6251 |
Type: | High Speed | Mounting Style: | SMD/SMT |
Data Rate: | 1 Mb/s | Number of Drivers: | 1 Driver |
Number of Receivers: | 1 Receiver | Supply Voltage - Min: | 5 V |
Supply Voltage - Max: | 40 V | Minimum Operating Temperature: | - 40 C |
Maximum Operating Temperature: | + 150 C | Operating Supply Current: | 50 mA |
ESD Protection: | 8 kV | Qualification: | AEC-Q100 |
Packaging: | Cut Tape | Brand: | Infineon Technologies |
Moisture Sensitive: | Yes | Product Type: | CAN Interface IC |
Factory Pack Quantity: | 2500 | Subcategory: | Interface ICs |
Part # Aliases: | TLE62513GXT SP000823130 TLE62513GXUMA1 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The TLE6251-3G chip is a highly integrated LIN transceiver designed for automotive applications. It provides a communication interface between an electronic control unit (ECU) and local interconnect network (LIN) bus. The chip features high-speed LIN functionality, low power consumption, and robust electrical performance. It is commonly used for body control modules, lighting control units, and seat control units in vehicles.
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Equivalent
The equivalent products of the TLE6251-3G chip include TJA1055T/3 and TJA1055CT/3, both from Infineon Technologies. These chips are also high-speed CAN transceivers designed for automotive applications with similar features and functionality. -
Features
The TLE6251-3G is a high-speed CAN transceiver featuring a loop-back mode for self-test, overload protection, and an integrated LDO regulator for 5V supply. It offers excellent electromagnetic compatibility, low power consumption, and comes in a small package size, making it suitable for automotive and industrial applications. -
Pinout
The TLE6251-3G is an enhanced high-speed CAN transceiver. It has a 14-pin count and offers fault detection, bus wake-up capability, bus error protection, and mode control functions. This transceiver is primarily used in automotive applications for communication between different electronic control units. -
Manufacturer
Infineon Technologies AG is the manufacturer of the TLE6251-3G. It is a German semiconductor manufacturer and one of the world's largest suppliers of automotive components. Infineon produces a wide range of products including power semiconductors, microcontrollers, sensors, and chipsets used in various industries such as automotive, industrial, and consumer electronics. -
Application Field
The TLE6251-3G is a high-speed LIN transceiver designed for use in automotive applications. It is commonly used in areas such as body control modules, central door locks, HVAC systems, and power distribution units. It enables reliable and efficient communication between various electronic control units within a vehicle. -
Package
The TLE6251-3G chip is available in a surface-mount package type known as PG-DSO-8. It has a standard form factor and its package size measures approximately 5.4mm x 4.4mm x 1.2mm.
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