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Intel TE28F256J3C125
NOR Flash Parallel 3V/3.3V 256M-bit 32M x 8/16M x 16 125ns 56-Pin TSOP Tray
Brands: Intel Corp
Mfr.Part #: TE28F256J3C125
Datasheet: TE28F256J3C125 Datasheet (PDF)
Package/Case: TSOP56
Product Type: Memory
RoHS Status:
Stock Condition: 2621 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomTE28F256J3C125 General Description
TE28F256J3C125 is a Flash memory chip manufactured by Intel Corporation. Here are some of its features:
Features
- Density: 256 Megabit
- Organization: 32 Megabytes x 8
- Voltage: 2.7V to 3.6V
- Access time: 125 ns
- Interface: 16-bit
Application
- AM28F256J3C-125E
- S29GL256P90TFIR20
- AT49BV8192AT-11TC
- M29F400BT-90M1
- CY62128BLL-70SXI
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| place | launch_date | Nov 23, 2004 | |
| last_inspection_date | 02 MAY 2023 | rohs_version | 2011/65/EU, 2015/863 |
| supplier_cage_code | 6Y440 | htsusa | 8542320071 |
| schedule_b | 8542320070 | ppap | |
| aec |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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![Product]( "Product")
Step1 :Product
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![Vacuum packaging]( "Vacuum packaging")
Step2 :Vacuum packaging
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![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
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![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
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![Packaging boxes]( "Packaging boxes")
Step5 :Packaging boxes
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![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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TE28F256J3C125 is a 256Mb flash memory chip manufactured by Intel. It features a 125 nanosecond access time and a 3V power supply. The chip is commonly used in embedded systems, automotive applications, and industrial equipment. It offers reliable data storage and fast read/write speeds for various electronic devices.
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Equivalent
Some equivalent products to the TE28F256J3C125 chip include the Intel P30J3A, Atmel AT29C256, and Macronix MX29F. These chips are also 256Mb (32MB) flash memory devices with similar specifications and functionality. -
Features
- 256Mb (32MB) NOR Flash Memory - 125ns access time - 1.8V to 3.6V operating voltage - Industrial temperature range (-40°C to 85°C) - 64-word/128-byte block erase - Compatible with asynchronous 30ns SRAM or EPROM - Common Flash Interface (CFI) compliant - Available in 56-pin TSOP package -
Pinout
The TE28F256J3C125 has a pin count of 48. It is a 256 Mb flash memory device with a 125ns access time. It is commonly used in embedded systems for program storage and data logging applications. -
Manufacturer
The TE28F256J3C125 is manufactured by Micron Technology Inc., a multinational corporation specializing in memory and storage solutions for various industries including consumer electronics, automotive, and industrial applications. Micron is a leading provider of DRAM, NAND, NOR flash memory, and SSD products. -
Application Field
The TE28F256J3C125 is commonly used in telecommunications equipment, industrial automation systems, automotive electronics, medical devices, and consumer electronics for applications such as data storage, program memory, firmware storage, and code execution. -
Package
The TE28F256J3C125 chip is a BGA (Ball Grid Array) package with a rectangular form and a size of 14mm x 20mm.
Datasheet PDF
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365 days quality guarantee for all products
