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Intel PC28F256P30B85
FLASH - NOR Memory IC 256Mbit Parallel 52 MHz 85 ns 64-EasyBGA (10x13)
Brands: Intel Corp
Mfr.Part #: PC28F256P30B85
Datasheet: PC28F256P30B85 Datasheet (PDF)
Package/Case: BGA64
Product Type: Memory
PC28F256P30B85 General Description
FLASH - NOR Memory IC 256Mbit Parallel 52 MHz 85 ns 64-EasyBGA (10x13)
Features
- 256 Mb (32 MB) density
- 3.0V to 3.6V operating voltage
- Page size of 4KB
- Sector size of 256KB
- 85ns access time
- Parallel NOR interface
- RoHS compliant
Application
- Automotive and industrial control systems
- Network infrastructure equipment
- Data storage devices
- Consumer electronics devices
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Rohs Code | Yes | Part Life Cycle Code | Transferred |
| Ihs Manufacturer | INTEL CORP | Part Package Code | BGA |
| Package Description | LEAD FREE, BGA-64 | Pin Count | 64 |
| Reach Compliance Code | compliant | ECCN Code | EAR99 |
| HTS Code | 8542.32.00.51 | Access Time-Max | 88 ns |
| Additional Feature | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | Boot Block | BOTTOM |
| Command User Interface | YES | Common Flash Interface | YES |
| Data Polling | NO | JESD-30 Code | R-PBGA-B64 |
| JESD-609 Code | e1 | Length | 13 mm |
| Memory Density | 268435456 bit | Memory IC Type | FLASH |
| Memory Width | 16 | Number of Functions | 1 |
| Number of Sectors/Size | 4,255 | Number of Terminals | 64 |
| Number of Words | 16777216 words | Number of Words Code | 16000000 |
| Operating Mode | ASYNCHRONOUS | Operating Temperature-Max | 85 °C |
| Operating Temperature-Min | -40 °C | Organization | 16MX16 |
| Package Body Material | PLASTIC/EPOXY | Package Code | TBGA |
| Package Equivalence Code | BGA64,8X8,40 | Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE | Page Size | 4 words |
| Parallel/Serial | PARALLEL | Peak Reflow Temperature (Cel) | 260 |
| Programming Voltage | 1.8 V | Qualification Status | Not Qualified |
| Seated Height-Max | 1.2 mm | Sector Size | 16K,64K |
| Standby Current-Max | 0.000005 A | Supply Current-Max | 0.051 mA |
| Supply Voltage-Max (Vsup) | 2 V | Supply Voltage-Min (Vsup) | 1.7 V |
| Supply Voltage-Nom (Vsup) | 1.8 V | Surface Mount | YES |
| Technology | CMOS | Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | Terminal Form | BALL |
| Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 | Toggle Bit | NO |
| Type | NOR TYPE |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the PC28F256P30B85 component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : AT49BV256-90TI
Brands :
Package :
Description :
Part Number : AT49BV256-12TI
Brands :
Package :
Description :
Part Number : M29F200BB70N6E
Brands :
Package :
Description :
Part Number : M29F200BB90N6E
Brands :
Package :
Description :
Part Number : MX29LV256DBTI-70G
Brands :
Package :
Description :
Part Number : MX29LV256DBTI-90G
Brands :
Package :
Description :
Part Number : S29GL256N10TFI020
Brands :
Package :
Description :
Part points
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The PC28F256P30B85 is a 256-megabit NAND Flash memory chip manufactured by Intel. It offers fast read and program speeds, high reliability, and a high storage capacity. The chip is commonly used in industrial applications, automotive systems, and embedded devices.
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Equivalent
The equivalent products of the PC28F256P30B85 chip are the Micron N25Q256A13ESE40G, Spansion S25FL256SAGMFV101, and Winbond W25Q256FVSG. These chips offer similar features and performance characteristics, making them suitable replacements for the PC28F256P30B85. -
Features
PC28F256P30B85 is a 256Mb NOR flash memory device with P30 sector erase architecture, 1.8V supply voltage, and industrial temperature range. It offers fast read and program operation, reliable performance, and high endurance. This flash memory also has a 64-byte page size and a 30ns access time. -
Pinout
The PC28F256P30B85 is a 48-pin BGA memory device with a capacity of 256Mbit (32MB). Its primary function is storing data for digital devices such as routers, switches, and network equipment. The device uses a 1.8V power supply and operates at a speed of 85ns. -
Manufacturer
The PC28F256P30B85 is manufactured by Intel Corporation. Intel is a multinational technology company that designs and manufactures computer processors and related technologies for a wide range of devices, including personal computers, servers, and mobile devices. Intel is one of the largest semiconductor chip makers in the world. -
Application Field
The PC28F256P30B85 is commonly used in embedded systems, consumer electronics, industrial equipment, automotive applications, and networking devices. It is suitable for applications requiring high performance, reliability, and low power consumption, such as solid-state drives, digital cameras, printers, routers, and telecommunication equipment. -
Package
The PC28F256P30B85 chip is in the BGA package type, has a 28-ball form factor, and is size 8mm x 6mm.
Datasheet PDF
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
Fine for non-critical applications, but not recommended for long-term use.