ST ST485EXDR

Part points

• The ST485EXDR is a chip designed for use in industrial applications as a half-duplex RS-485/RS-422 transceiver. It provides a robust communication interface, allowing for long-distance data transmission with minimal noise interference. The chip features advanced protection mechanisms and operates over a wide temperature range, making it suitable for harsh environments.

• Equivalent

  Some equivalent products of the ST485EXDR chip are the MAX485 and LTC485 chips. These chips are also RS-485/RS-422 transceivers with similar features and pinouts.

• Features

  ST485EXDR is a transceiver IC designed for RS-485/RS-422 communication, offering enhanced electrostatic discharge (ESD) protection. It provides half-duplex communication, operates with a supply voltage range from 4.5V to 5.5V, and supports data rates up to 20 Mbps. The IC features fail-safe circuitry, thermal shutdown, and receiver/driver enable features.

• Pinout

  The ST485EXDR is a 8-pin RS-485 transceiver that supports half-duplex communication. The pin functions are as follows: pin 1 (DE / RE) for driver enable and receiver enable control, pin 2 (A) for the non-inverting driver output and receiver input, pin 3 (B) for the inverting driver output and receiver input, and pins 4 to 8 are for power and ground connections.

• Manufacturer

  The ST485EXDR is manufactured by STMicroelectronics. It is a multinational semiconductor company that designs, manufactures, and supplies a wide range of integrated circuits and solutions used in various electronic applications.

• Application Field

  The ST485EXDR is commonly used in various applications such as industrial automation, process control systems, instrumentation, and communication systems. It is specifically designed for half-duplex RS-485 communication, making it ideal for applications that require long-distance communication and noise immunity.

• Package

  The ST485EXDR chip is available in an SOIC-8 package type. It has a small size of 5.3mm x 6.2mm, making it suitable for compact electronic devices and applications requiring space-efficient designs.