Orders Over
$5000H5TQ4G63AFR-RDC
CMOS technology
Brands: Sk Hynix Inc
Mfr.Part #: H5TQ4G63AFR-RDC
Datasheet: H5TQ4G63AFR-RDC Datasheet (PDF)
Package/Case: FBGA-96
Product Type: Memory
RoHS Status:
Stock Condition: 7,143 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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H5TQ4G63AFR-RDC General Description
H5TQ4G63AFR-RDC is a high-performance 4Gb LPDDR3 mobile DRAM chip manufactured by SK Hynix. It features a storage capacity of 4 gigabits, operating at a speed of up to 1866MHz. The chip is designed for use in mobile devices such as smartphones, tablets, and other portable electronics, offering fast and efficient data processing.With a low power consumption design, the H5TQ4G63AFR-RDC helps extend the battery life of mobile devices, making it ideal for use in energy-efficient products. The chip also incorporates a burst mode, allowing for rapid data transfer rates and smooth multitasking performance.In addition, the H5TQ4G63AFR-RDC supports advanced features like on-die termination (ODT) and auto temperature-compensated self-refresh (ATCSR), ensuring reliable and stable operation under varying conditions.
Features
Application
Specifications
Parameter | Value | Parameter | Value |
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Rohs Code | Yes | Part Life Cycle Code | Obsolete |
Ihs Manufacturer | SK HYNIX INC | Part Package Code | BGA |
Package Description | TFBGA, BGA96,9X16,32 | Pin Count | 96 |
ECCN Code | EAR99 | HTS Code | 8542.32.00.36 |
Access Mode | MULTI BANK PAGE BURST | Access Time-Max | 0.195 ns |
Additional Feature | AUTO/SELF REFRESH | Clock Frequency-Max (fCLK) | 933 MHz |
I/O Type | COMMON | Interleaved Burst Length | 4,8 |
JESD-30 Code | R-PBGA-B96 | Length | 13 mm |
Memory Density | 4294967296 bit | Memory IC Type | DDR3 DRAM |
Memory Width | 16 | Number of Functions | 1 |
Number of Ports | 1 | Number of Terminals | 96 |
Number of Words | 268435456 words | Number of Words Code | 256000000 |
Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
Organization | 256MX16 | Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY | Package Code | TFBGA |
Package Equivalence Code | BGA96,9X16,32 | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Qualification Status | Not Qualified | Refresh Cycles | 8192 |
Seated Height-Max | 1.2 mm | Self Refresh | YES |
Sequential Burst Length | 4,8 | Standby Current-Max | 0.017 A |
Supply Current-Max | 0.225 mA | Supply Voltage-Max (Vsup) | 1.575 V |
Supply Voltage-Min (Vsup) | 1.425 V | Supply Voltage-Nom (Vsup) | 1.5 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | OTHER | Terminal Form | BALL |
Terminal Pitch | 0.8 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The H5TQ4G63AFR-RDC is a high-performance NAND flash memory chip commonly used in mobile devices, offering fast data transfer rates and high storage capacity. It's designed for applications requiring reliable and efficient storage solutions.
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Equivalent
Equivalent products to the H5TQ4G63AFR-RDC chip include: 1. Micron MT29F32G08CBACAWP-IT: 4Gb NAND Flash. 2. Samsung K4G80325FC-HC28: 4Gb LPDDR4X SDRAM. 3. SK Hynix H9HCNNN8GALUZR-NEH: 4Gb LPDDR4X SDRAM. -
Features
H5TQ4G63AFR-RDC is a DDR3 SDRAM chip with a capacity of 4 gigabits. It operates at a speed of 2133 MHz and is designed for mobile devices. It features low power consumption and a compact form factor, making it suitable for use in smartphones, tablets, and other portable electronics. -
Pinout
The H5TQ4G63AFR-RDC is a 4Gb LPDDR4 SDRAM with a 78-ball FBGA package. It has a 27-bit data bus with a supply voltage of 1.1V. The pin count is 78 pins. This memory chip is commonly used in mobile devices and offers high-performance and low power consumption. -
Manufacturer
The manufacturer of the H5TQ4G63AFR-RDC is SK Hynix. SK Hynix is a South Korean semiconductor company that specializes in the production of memory chips, including dynamic random-access memory (DRAM) and NAND flash memory. It's one of the world's largest memory chip manufacturers, competing with companies like Samsung and Micron. -
Application Field
The H5TQ4G63AFR-RDC is commonly used in mobile devices, such as smartphones and tablets, for its low power consumption and high data transfer rates. It's also suitable for automotive applications where reliability and performance are crucial, and in industrial and IoT devices where space constraints and energy efficiency are important considerations. -
Package
The H5TQ4G63AFR-RDC chip is packaged in a FBGA (Fine-pitch Ball Grid Array) format with a size of 8mm x 10mm.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products