H5TQ2G83GFR-RDC

Part points

• H5TQ2G83GFR-RDC is a memory chip primarily used in electronic devices such as smartphones, tablets, and gaming consoles. It belongs to the DDR4 SDRAM family, offering high-speed and reliable performance. The chip has a capacity of 2 gigabits per die and utilizes advanced technology to optimize power consumption. This makes it an ideal choice for devices requiring efficient memory solutions.

• Features

  H5TQ2G83GFR-RDC is a component of a specific type of dynamic random-access memory (DRAM) device. It features a memory capacity of 2 gigabits (Gb), a data transfer rate of 800 megabits per second (Mbps), and operates on a supply voltage of 1.8 volts (V). It is commonly used in high-performance computing and mobile devices.

• Pinout

  The H5TQ2G83GFR-RDC is a DDR3 SDRAM module with a 78-ball FBGA package. It has a 16-bit data bus and operates at a frequency of 533 MHz. The module supports various functions such as data storage and retrieval, and is commonly used in computer memory applications.

• Manufacturer

  The manufacturer of the H5TQ2G83GFR-RDC is SK Hynix Inc. It is a South Korean semiconductor company that specializes in the production of memory chips, flash memory, and dynamic random access memory (DRAM) products.

• Application Field

  The H5TQ2G83GFR-RDC is a high-speed, low-power double data rate synchronous DRAM (DDR SDRAM) that can be used in a variety of applications such as mobile devices, networking equipment, and industrial systems. It offers high memory capacity, fast data transfer rates, and low operating voltage, making it suitable for demanding and power-constrained environments.

• Package

  The H5TQ2G83GFR-RDC chip has a package type of FBGA, a form factor of 0.8mm pitch and a size of 11mm x 13mm.