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H57V2562GTR-60C

Synchronous DRAM, 16MX16, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, ROHS COMPLIANT, TSOP2-54

ISO14001 ISO9001 DUNS

Brands: SKHYNIX

Mfr.Part #: H57V2562GTR-60C

Datasheet: H57V2562GTR-60C Datasheet (PDF)

Package/Case: TSSOP-54

Product Type: Memory

RoHS Status:

Stock Condition: 6,422 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for H57V2562GTR-60C or email to us: Email: [email protected], we will contact you within 12 hours.

H57V2562GTR-60C General Description

Synchronous DRAM, 16MX16, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, ROHS COMPLIANT, TSOP2-54

Specifications

Parameter Value Parameter Value
Rohs Code Yes Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC Part Package Code TSOP2
Package Description TSOP2, TSOP54,.46,32 Pin Count 54
Reach Compliance Code ECCN Code EAR99
HTS Code 8542.32.00.24 Access Mode FOUR BANK PAGE BURST
Access Time-Max 5.4 ns Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 166 MHz I/O Type COMMON
Interleaved Burst Length 1,2,4,8 JESD-30 Code R-PDSO-G54
Length 22.22 mm Memory Density 268435456 bit
Memory IC Type SYNCHRONOUS DRAM Memory Width 16
Number of Functions 1 Number of Ports 1
Number of Terminals 54 Number of Words 16777216 words
Number of Words Code 16000000 Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C Operating Temperature-Min
Organization 16MX16 Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY Package Code TSOP2
Package Equivalence Code TSOP54,.46,32 Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Refresh Cycles 8192
Seated Height-Max 1.194 mm Self Refresh YES
Sequential Burst Length 1,2,4,8,FP Standby Current-Max 0.002 A
Supply Current-Max 0.09 mA Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES Technology CMOS
Temperature Grade COMMERCIAL Terminal Form GULL WING
Terminal Pitch 0.8 mm Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The H57V2562GTR-60C is a computer chip that is commonly used in electronic devices such as computers and smartphones. It is a 256 megabit (32 megabyte) DDR3 SDRAM chip that operates at a speed of 1333 MHz. The chip provides high-speed data transfer and storage capabilities, making it ideal for use in demanding applications.
  • Features

    The H57V2562GTR-60C is a 256 Megabit Double Data Rate 2 Synchronous DRAM module. It features a fast data transfer rate of 600 MHz and operates at a voltage of 1.8V, making it suitable for high-performance computing systems. It also has a 4-bank architecture and supports burst length of 2, 4, and 8.
  • Pinout

    The H57V2562GTR-60C is a DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) chip with a pin count of 96. It has a capacity of 256M bits (32M x 8 bits) and operates at a clock frequency of 600MHz. Its function is to provide high-speed data storage and retrieval for computer systems.
  • Manufacturer

    The manufacturer of the H57V2562GTR-60C is Hynix. Hynix is a South Korean company that specializes in the manufacturing of semiconductors and memory products.
  • Application Field

    The H57V2562GTR-60C is a 256 Mb SDRAM memory chip. It can be used in various applications, including embedded systems, network switches, routers, and other communication equipment, as well as consumer electronics such as gaming consoles and set-top boxes.
  • Package

    The H57V2562GTR-60C chip comes in a TSOP package type. It has a form factor of 400 mil and a size of 8M x 32-bit.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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