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ON FDS2670

N-Channel 200 V 3A (Ta) 2.5W (Ta) Surface Mount 8-SOIC

ISO14001 ISO9001 DUNS

Brands: ON Semiconductor, LLC

Mfr.Part #: FDS2670

Datasheet: FDS2670 Datasheet (PDF)

Package/Case: SOP-8

Product Type: Transistors

RoHS Status:

Stock Condition: 2274 pcs, New Original

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Quick Quote

Please submit RFQ for FDS2670 or email to us: Email: [email protected], we will contact you within 12 hours.

FDS2670 General Description

This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. These MOSFETs feature faster switching and lower gate charge than other MOSFETs with comparable RDS(ON) specifications. The result is a MOSFET that is easy and safer to drive (even at very high frequencies), and DC/DC power supply designs with higher overall efficiency.

fds2670

Features

  • 3.0A, 200 V
  • RDS(ON) = 130 mΩ @ VGS = 10 V
  • Low gate charge
  • Fast switching speed
  • High performance trench technology for extremely low RDS(ON)
  • High power and current handling capability

Application

  • This product is general usage and suitable for many different applications.

Specifications

Parameter Value Parameter Value
Source Content uid FDS2670 Pbfree Code Yes
Part Life Cycle Code Active Ihs Manufacturer ONSEMI
Package Description SOIC-8 Manufacturer Package Code 751EB
Reach Compliance Code compliant ECCN Code EAR99
Factory Lead Time 4 Weeks Samacsys Manufacturer onsemi
Configuration SINGLE WITH BUILT-IN DIODE DS Breakdown Voltage-Min 200 V
Drain Current-Max (ID) 3 A Drain-source On Resistance-Max 0.13 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR JESD-30 Code R-PDSO-G8
JESD-609 Code e3 Moisture Sensitivity Level 1
Number of Elements 1 Number of Terminals 8
Operating Mode ENHANCEMENT MODE Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY Package Shape RECTANGULAR
Package Style SMALL OUTLINE Peak Reflow Temperature (Cel) 260
Polarity/Channel Type N-CHANNEL Power Dissipation-Max (Abs) 2.5 W
Qualification Status Not Qualified Surface Mount YES
Terminal Finish MATTE TIN Terminal Form GULL WING
Terminal Position DUAL Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING Transistor Element Material SILICON
feature-category Power MOSFET feature-material
feature-process-technology PowerTrench feature-configuration Single Quad Drain Triple Source
feature-channel-mode Enhancement feature-channel-type N
feature-number-of-elements-per-chip 1 feature-maximum-drain-source-voltage-v 200
feature-maximum-gate-source-voltage-v ±20 feature-maximum-gate-threshold-voltage-v 4.5
feature-maximum-continuous-drain-current-a 3 feature-maximum-drain-source-resistance-mohm 130@10V
feature-typical-gate-charge-vgs-nc 27@10V feature-typical-gate-charge-10v-nc 27
feature-typical-input-capacitance-vds-pf 1228@100V feature-typical-output-capacitance-pf 112
feature-maximum-power-dissipation-mw 2500 feature-packaging Tape and Reel
feature-rad-hard feature-pin-count 8
feature-supplier-package SOIC feature-standard-package-name1 SO
feature-cecc-qualified No feature-esd-protection
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code EAR99
feature-svhc No

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The FDS2670 chip is an integrated circuit that combines a power MOSFET and a PWM controller into a single device. It is commonly used in applications such as power management, motor control, and battery charging. The chip offers a compact and efficient solution for driving high-current loads, providing improved performance and reliability.
  • Features

    The FDS2670 is a power MOSFET transistor with a high current rating of 57A, low on-resistance of 0.03 ohms, and a low gate charge of 22nC. It is designed for high-performance switching applications, offering efficient power delivery and reliable operation.
  • Pinout

    The FDS2670 is a dual N-channel MOSFET with a small pin count. It typically has 8 pins, including the gate, source, and drain pins for each of its two channels. The function of this device is to switch and control electrical current in electronic circuits.
  • Manufacturer

    The manufacturer of the FDS2670 is Fairchild Semiconductor. Fairchild Semiconductor is a multinational company that specializes in the design, development, and manufacturing of high-performance semiconductor products. They provide a wide range of solutions for markets including automotive, consumer electronics, industrial, and telecommunications.
  • Application Field

    The FDS2670 MOSFET can be used in various application areas, including power management, motor control, and switching applications. It is commonly used in portable devices, automotive electronics, and industrial control systems.
  • Package

    The FDS2670 chip has a package type of Power33, a form of SO-8, and a size of 5.0mm x 4.5mm.

Datasheet PDF

Preliminary Specification FDS2670 PDF Download

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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